Adhesives Technology For Electronic Applications

Approx.512 pages Approx.512 pages

This first book in the Materials and Processes for Electronics Applications series answers questions vital to the successful design and manufacturing of electronic components, modules, and systems such as: - How can one protect electronic assemblies from prolonged high humidity, high temperatures, salt spray or other terrestrial and space environments? - What coating types can be used to protect microelectronics in military, space, automotive, or medical environments? - How can the chemistry of polymers be correlated to desirable physical and electrical properties? - How can a design engineer avoid subsequent potential failures due to corrosion, metal migration, electrical degradation, outgassing? - What are the best processes that manufacturing can use to mask, clean, prepare the surface, dispense the coating, and cure the coating? - What quality assurance and in-process tests can be used to assure reliability? - What government or industry specifications are available? - How can organic coatings be selected to meet OSHA, EPA, and other regulations? Besides a discussion of the traditional roles of coatings for moisture and environmental protection of printed circuit assemblies, this book covers dielectric coatings that provide electrical functions such as the low-dielectric-constant dielectrics used to fabricate multilayer interconnect substrates and high-frequency, high-speed circuits. Materials engineers and chemists will benefit greatly from a chapter on the chemistry and properties of the main types of polymer coatings including: Epoxies, Polyimides, Silicones, Polyurethanes, Parylene, Benzocyclobenzene and many others. For manufacturing personnel, there is an entire chapter of over a dozen processes for masking, cleaning, and surface preparation and a comprehensive review of over 20 processes for the application and curing of coatings including recent extrusion, meniscus, and curtain coating methods used in processing large panels. The pros and cons of each method are given to aid the engineer in selecting the optimum method for his/her application. As a bonus, from his own experience, the author discusses some caveats that will help reduce costs and avoid failures. Finally, the author discusses regulations of OSHA, EPA, and other government agencies which have resulted in formulation changes to meet VOC and toxicity requirements. Tables of numerous military, commercial, industry, and NASA specifications are given to help the engineer select the proper callout.

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques

Following the successful first, the second edition is a complete guide to all that is required to successfully bond materials. It is both a reference and a source for learning the basics for those involved in the entire product value chains. Basic principles of adhesion such as surface characterization, types of adhesive bonds, and adhesion failure topics are covered in addition to a description of common adhesive materials and application techniques. Provides the end user practitioners of adhesion technology with a complete guide to bonding materials successfully Covers most substrates, including plastics, metals, elastomers and ceramics, explaining basic principles and describing common materials and application techniques Arranges information so that each chapter can be studied selectively or in conjunction with others

Covering a wide range of industrial applications across sectors including medical applications, automotive/aerospace, packaging, electronics, and consumer goods, this book provides a complete guide to the selection of adhesives, methods of use, industrial applications, and the fundamentals of adhesion. Dr Ebnesajjad examines the selection of adhesives and adhesion methods and challenges for all major groups of substrate including plastics (thermosets and thermoplastics), elastomers, metals, ceramics and composite materials. His practical guidance covers joint design and durability, application methods, test methods and troubleshooting techniques. The science and technology of adhesion, and the principles of adhesive bonding are explained in a way that enhances the reader's understanding of the fundamentals that underpin the successful use and design of adhesives. The third edition has been updated throughout to include recent developments in the industry, with new sections covering technological advances such as nanotechnology, micro adhesion systems, and the replacement of toxic chromate technology. Provides practitioners of adhesion technology with a complete guide to bonding materials successfully Covers the whole range of commonly used substrates including plastics, metals, elastomers and ceramics, explaining basic principles and describing common materials and application techniques Introduces the range of commercially available adhesives and the selection process alongside the science and technology of adhesion

The Handbook of Adhesive Technology, Second Edition exceeds the ambition of its bestselling forerunner by reexamining the mechanisms driving adhesion, categories of adhesives, techniques for bond formation and evaluation, and major industrial applications. Integrating modern technological innovations into adhesive preparation and application, this greatly expanded and updated edition comprises a total of 26 different adhesive groupings, including three new classes. The second edition features ten new chapters, a 40-page list of resources on adhesives, and abundant figures, tables, equations.

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Includes coverage of environmentally friendly 'green encapsulants' Presents coverage of faults and defects, and how to analyze and avoid them

The Book Covers Introduction, Historical Development Of Adhesives And Adhesive Bonding, Types Of Adhesives, Emulsion And Dispersion Adhesives, Testing Of Adhesives, Protein Adhesives For Wood, Hot Melt Adhesives, Animal Glues And Adhesives, Polyvinyl Acetate/Alcohol Based Adhesives, Ethylene-Vinyl Acetate Copolymers, Polyvinyl Acetal Adhesives, Silicone Adhesives, Epoxide Adhesives, Polyester Adhesives, Polyester Adhesives, Phenolic Resin Adhesives, Cellulose Derivative Adhesives, Epoxy Polyurethane Adhesives, Polyisocyanate /Polyurethane Adhesive, Amine (Urea & Melamine) Formaldehyde Adhesives, Paper, Board & Packaging Adhesives, Remoistenable Adhesives, Gum Arabic Etc. Adhesives, Footwear Applications Of Adhesives, High-Temperature Adhesives, Dispensing Of Adhesives, Natural Rubber Based Adhesives, Polysulfied Sealants And Adhesives, Phenolic Resin Adhesives, Urea-Formaldehyde Adhesives, Melamine-Formaldehyde Adhesives, Polyurethane Adhesives, Unsaturated Polyester Adhesives, Reactive Acrylic Adhesives, Technology Of Cyanoacrylate Adhesives For Industrial Assembly, Silicone Adhesives And Sealants, Epoxy Resin Adhesives, Pressure Sensitive Adhesives, Adhesives In The Automotive Industry, Adhesive Based On Vinyl Acetate, Adhesive Based On Vinyl Acetate, Leather Based Adhesive, Latex Rubber Based Adhesive, Starch And Dextrin Based Adhesive, Adhesive For Corrugation Dry Powder And Paste, Adhesive (Different Type), Adhesive Industries (Laminated, Fevicol, Sticker Ddl And Other Types Of Adhesive), Rubber Adhesive, Adhesive (Polyvinyl Butyral Based), Self Adhesive Labels, Ester Gums (Food Grade), Vulcanizing Rubber Solution/Cement For Automobile Tyres, Industrial Adhesive Based On Starch Gum, Dextrin Silicate, Suppliers Of Plant And Machineries, Suppliers Of Raw Materials.