Chinese Journal Of Electronics

The first book on Prognostics and Health Management of Electronics Recently, the field of prognostics for electronic products has received increased attention due to the potential to provide early warning of system failures, forecast maintenance as needed, and reduce life cycle costs. In response to the subject's growing interest among industry, government, and academic professionals, this book provides a road map to the current challenges and opportunities for research and development in Prognostics and Health Management (PHM). The book begins with a review of PHM and the techniques being developed to enable a prognostics approach for electronic products and systems. building on this foundation, the book then presents the state of the art in sensor systems for in-situ health and usage monitoring. Next, it discusses the various models and algorithms that can be utilized in PHM. Finally, it concludes with a discussion of the opportunities in future research. Readers can use the information in this book to: Detect and isolate faults Reduce the occurrence of No Fault Found (NFF) Provide advanced warning of system failures Enable condition-based (predictive) maintenance Obtain knowledge of load history for future design, qualification, and root cause analysis Increase system availability through an extension of maintenance cycles and/or timely repair actions Subtract life cycle costs of equipment from reduction in inspection costs, down time, and inventory Prognostics and Health Management of Electronics is an indispensable reference for electrical engineers in manufacturing, systems maintenance, and management, as well as design engineers in all areas of electronics.

ECWAC2012 is an integrated conference devoted to Electronic Commerce, Web Application and Communication. In the this proceedings you can find the carefully reviewed scientific outcome of the second International Conference on Electronic Commerce, Web Application and Communication (ECWAC 2012) held at March 17-18,2012 in Wuhan, China, bringing together researchers from all around the world in the field.

The first book of its kind to focus on the coupling theory, methodology and applications of microwave equipment Electromechanical Coupling Theory, Methodology and Applications for High-Performance Microwave Equipment is an authoritative and up-to-date guide to the structural, mechanical, and electrical aspects of electromechanical coupling. Addressing control, electromagnetism, and structural engineering, this comprehensive reference addresses the electromechanical coupling of high-performance microwave electronic equipment (MEE), such as antennas, radar, large radio telescopes, and telecommunication and navigation equipment. The book is divided into four main sections, beginning with an introduction to electromechanical coupling (EMC) theory and a detailed description of the multi-field coupling model (MFCM) and the influence mechanism (IM) of nonlinear factors of antenna-servo-feeder systems on performance. Subsequent sections discuss MFCM- and IM-based design methodology, EMC-based measurement and testing, computer software for coupling analysis and design of electronic equipment, and various engineering applications of EMC theory and the IM of typical electronic equipment. In addition, the book: Discusses information and data transfer in electromagnetic fields, mechanical and structural deformation fields, and temperature fields Explains how high-performance microwave electronic equipment differs from traditional mechanical equipment Addresses EMC-based and general design-vector based optimization of electronic equipment design Describes applications such as a gun-guided radar system for warships and a large-diameter antenna for moon exploration Includes evaluation criteria to validate MFCM/IM design theory and methodology Electromechanical Coupling Theory, Methodology and Applications for High-Performance Microwave Equipment is essential reading for circuit designers, microwave engineers, researchers working with high-frequency microwave engineering, and engineers working with integrated circuits in radar, communications, IoT, antenna engineering, and remote sensing.

Thermal Management Materials for Electronic Packaging Practical resource exploring the theoretical and experimental basis as well as solutions for the development of new thermal management materials for electronic packaging Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices provides in-depth and systematic summaries on cutting-edge thermal management materials for high-power density electronic devices, introducing the preparation methods and application scenarios of thermal management materials for electronic packing, covering refinements of thermal conductivity theory and performance prediction models for multiphase composites, and overall focusing on key scientific issues related to the subject, such as the internal interface of new high thermal conductive substrate materials and the mechanism of spatial topology on performance. The text also discusses key issues on the design and preparation of thermal conductive substrate materials with high thermal conductive properties, including their characterization, properties, and manipulation, as well as the latest methods, techniques, and applications in this rapidly developing area. Sample topics covered in Thermal Management Materials for Electronic Packaging include: Basic concepts and laws of thermal conduction, heat conduction differential equation and finite solution, and thermal conductivity of solids Definition and classification of electronic packaging, thermal management in electronic equipment, and requirements of electronic packaging materials Synthesis and surface modification of high thermal conductive filler and the synthesis of substrates and preparation of thermal conductive composites with inorganic ceramic skeleton structure Assembly of thermal conductive materials in different dimensions and preparation of composite materials, and reliability analysis and environmental performance evaluation Thermal Management Materials for Electronic Packaging serves as an ideal reference for researchers and workers in related fields to significantly improve the mechanical and thermal management properties of materials, expand the material selection and design margin of substrates, and develop substrates that meet the application needs of different gradients.

The two volume set LNAI 3801 and LNAI 3802 constitute the refereed proceedings of the annual International Conference on Computational Intelligence and Security, CIS 2005, held in Xi'an, China, in December 2005. The 338 revised papers presented - 254 regular and 84 extended papers - were carefully reviewed and selected from over 1800 submissions. The first volume is organized in topical sections on learning and fuzzy systems, evolutionary computation, intelligent agents and systems, intelligent information retrieval, support vector machines, swarm intelligence, data mining, pattern recognition, and applications. The second volume is subdivided in topical sections on cryptography and coding, cryptographic protocols, intrusion detection, security models and architecture, security management, watermarking and information hiding, web and network applications, image and signal processing, and applications.

The rise of mobile phones has brought about a new era of technological attachment as an increasing number of people rely on their personal mobile devices to conduct their daily activities. Due to the ubiquitous nature of mobile phones, the impact of these devices on human behavior, interaction, and cognition has become a widely studied topic. The Encyclopedia of Mobile Phone Behavior is an authoritative source for scholarly research on the use of mobile phones and how these devices are revolutionizing the way individuals learn, work, and interact with one another. Featuring exhaustive coverage on a variety of topics relating to mobile phone use, behavior, and the impact of mobile devices on society and human interaction, this multi-volume encyclopedia is an essential reference source for students, researchers, IT specialists, and professionals seeking current research on the use and impact of mobile technologies on contemporary culture.

The three volume set LNCS 5551/5552/5553 constitutes the refereed proceedings of the 6th International Symposium on Neural Networks, ISNN 2009, held in Wuhan, China in May 2009. The 409 revised papers presented were carefully reviewed and selected from a total of 1.235 submissions. The papers are organized in 20 topical sections on theoretical analysis, stability, time-delay neural networks, machine learning, neural modeling, decision making systems, fuzzy systems and fuzzy neural networks, support vector machines and kernel methods, genetic algorithms, clustering and classification, pattern recognition, intelligent control, optimization, robotics, image processing, signal processing, biomedical applications, fault diagnosis, telecommunication, sensor network and transportation systems, as well as applications.