2021 Ieee International Conference On Omni Layer Intelligent Systems Coins

Vertical and Topical Area Tracks on AI driven IoT from Edge to Cloud and Applications

IEEE COINS includes a multi disciplinary program from technical research papers, to panels, workshops, and tutorials on the latest technology developments and innovations addressing all important aspects of the IoT & AI ecosystem

Cross layer AI driven IoT from device, to edge, and cloud

This book constitutes the refereed proceedings of the 9th EAI International Conference on Industrial Networks and Intelligent Systems, INISCOM 2023, held in Ho-Chi-Minh City, Vietnam, during August 2-3, 2023. The 23 full papers were selected from 55 submissions and are organized thematically in tracks on telecommunications systems and networks; information processing and data analysis; industrial networks and intelligent systems; security and privacy.

This book reports on cutting-edge research and developments focusing on integrating intelligent functionalities into materials, components, systems and products. Gathering the proceedings of the 6th International Conference on System-Integrated Intelligence (SysInt 2022), held on September 7-9, in Genova, Italy, it offers a comprehensive, multidisciplinary and applied perspective on the state-of-the art and challenges in the field of intelligent, flexible and connected systems. The book covers advanced methods and applications relating to artificial, pervasive and ubiquitous intelligence, sensors, smart factory and logistics, structural health monitoring, as well as soft robotics, cognitive systems and human-machine interaction. Giving a special focus to artificial intelligence, it extensively reports on methods and algorithms for data-driven modeling, and agent-based data processing and planning. It aims at inspiring and fostering collaboration between researchers and professionals from the different fields of electrical, manufacturing and production engineering, and materials and computer sciences.