3d Stacked Memory

Our report on 3D stacked memory technology covers the Intellectual Property (Patent) landscape of this rapidly evolving technology and monitors its various sub-domains for licensing activity. We have analyzed the IP portfolios of SanDisk, Micron, Samsung, IBM and other major players to find the focus areas of their patenting efforts. Using our proprietary patent analytics tool, LexScore™, we identify the front runners in this technology domain with strong patent portfolio quality as well as a heavy patent filing activity. Using our proprietary Licensing Heat-map framework, we also predict licensing activity trend in various technology sub domains.

This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.

The large scale integration and planar scaling of individual system chips is reaching an expensive limit. If individual chips now, and later terrabyte memory blocks, memory macros, and processing cores, can be tightly linked in optimally designed and processed small footprint vertical stacks, then performance can be increased, power reduced and cost contained. This book reviews for the electronics industry engineer, professional and student the critical areas of development for 3D vertical memory chips including: gate-all-around and junction-less nanowire memories, stacked thin film and double gate memories, terrabit vertical channel and vertical gate stacked NAND flash, large scale stacking of Resistance RAM cross-point arrays, and 2.5D/3D stacking of memory and processor chips with through-silicon-via connections now and remote links later. Key features: Presents a review of the status and trends in 3-dimensional vertical memory chip technologies. Extensively reviews advanced vertical memory chip technology and development Explores technology process routes and 3D chip integration in a single reference

The book covers a range of topics dealing with emerging computing technologies which are being developed in response to challenges faced due to scaling CMOS technologies. It provides a sneak peek into the capabilities unleashed by these technologies across the complete system stack, with contributions by experts discussing device technology, circuit, architecture and design automation flows. Presenting a gradual progression of the individual sub-domains and the open research and adoption challenges, this book will be of interest to industry and academic researchers, technocrats and policymakers. Chapters "Innovative Memory Architectures Using Functionality Enhanced Devices" and "Intelligent Edge Biomedical Sensors in the Internet of Things (IoT) Era" are available open access under a Creative Commons Attribution 4.0 International License via link.springer.com.

The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.

This book provides a structured introduction of the key concepts and techniques that enable in-/near-memory computing. For decades, processing-in-memory or near-memory computing has been attracting growing interest due to its potential to break the memory wall. Near-memory computing moves compute logic near the memory, and thereby reduces data movement. Recent work has also shown that certain memories can morph themselves into compute units by exploiting the physical properties of the memory cells, enabling in-situ computing in the memory array. While in- and near-memory computing can circumvent overheads related to data movement, it comes at the cost of restricted flexibility of data representation and computation, design challenges of compute capable memories, and difficulty in system and software integration. Therefore, wide deployment of in-/near-memory computing cannot be accomplished without techniques that enable efficient mapping of data-intensive applications to such devices, without sacrificing accuracy or increasing hardware costs excessively. This book describes various memory substrates amenable to in- and near-memory computing, architectural approaches for designing efficient and reliable computing devices, and opportunities for in-/near-memory acceleration of different classes of applications.

This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.

This book focuses on soft computing and how it can be applied to solve real-world problems arising in various domains, ranging from medicine and healthcare, to supply chain management, image processing, and cryptanalysis. It gathers high-quality papers presented at the International Conference on Soft Computing: Theories and Applications (SoCTA 2021), organized online. The book offers valuable insights into soft computing for teachers and researchers alike; the book will inspire further research in this dynamic field.