Advanced Measurement And Test

Volume is indexed by Thomson Reuters CPCI-S (WoS). This second collection on “Advanced Measurement and Test II” is dedicated to the electronic testing of devices, boards and systems; covering the complete cycle from design verification, design-for-testing, design-for-manufacturing, silicon de-bugging, manufacturing testing, system testing, diagnosis, failure analysis ... and back to process and design improvement. This will be an invaluable guide to the topics.

The primary aim of the proceeding is the combined coverage of the electronic test of devices, boards and systems—covering the complete cycle from design verification, design-for-test, design-for-manufacturing, silicon debug, manufacturing test, system test, diagnosis, failure analysis and back to process and design improvement at the advanced level. Such an approach enables the engineer to take into account the essential mechanical properties of the material itself and special features of practical implementation, including manufacturing technology, experimental results, and design characteristics.

A collection on Advanced Measurement and Test that is dedicated to the electronic testing of devices, boards and systems and covers the complete cycle: from design verification, design-for-testing, design-for-manufacturing, silicon debug, manufacturing test, system test, diagnosis, failure analysis and back to process and design improvement.

This special collection on Advanced Measurement and Test is dedicated to the electronic testing of devices, boards and systems and covers the complete cycle: from design verification, design-for-testing, design-for-manufacturing, silicon debug, manufacturing test, system test, diagnosis, failure analysis and back to process and design improvement. Design, testing and yield professionals were invited to confront the challenges which the industry faces, and to learn how these challenges are being addressed by the combined efforts of academia, design tool and equipment suppliers, designers and test engineers.

Collection of selected, peer reviewed papers from the 2014 4th International Conference on Advanced Measurement and Test, (AMT 2014), November 1-2, 2014, Wuhan, China. The 37 papers are grouped as follows: Chapter 1: Materials Science; Chapter 2: Material Processing and Testing Technology; Chapter 3: Monitoring, Detection, Testing and Measurement Systems and Technologies

A Comprehensive Guide to Physical Layer Test and Measurement of Digital Communication Links Today's new data communication and computer interconnection systems run at unprecedented speeds, presenting new challenges not only in the design, but also in troubleshooting, test, and measurement. This book assembles contributions from practitioners at top test and measurement companies, component manufacturers,and universities. It brings together information that has never been broadly accessible before—information that was previously buried in application notes, seminar and conference presentations, short courses, and unpublished works. Readers will gain a thorough understanding of the inner workings of digital high-speed systems, and learn how the different aspects of such systems can be tested. The editors and contributors cover key areas in test and measurement of transmitters (digital waveform and jitter analysis and bit error ratio), receivers (sensitivity, jitter tolerance, and PLL/CDR characterization), and high-speed channel characterization (in time and frequency domain). Extensive illustrations are provided throughout. Coverage includes Signal integrity from a measurement point of view Digital waveform analysis using high bandwidth real-time and sampling (equivalent time) oscilloscopes Bit error ratio measurements for both electrical and optical links Extensive coverage on the topic of jitter in high-speed networks State-of-the-art optical sampling techniques for analysis of 100 Gbit/s + signals Receiver characterization: clock recovery, phase locked loops, jitter tolerance and transfer functions, sensitivity testing, and stressed-waveform receiver testing Channel and system characterization: TDR/T and frequency domain-based alternatives Testing and measuring PC architecture communication links: PCIexpress, SATA, and FB DIMM