Advanced Metallization Conference In
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Advanced Metallization Conference in
Author | : Anonim |
Publsiher | : Unknown |
Total Pages | : 730 |
Release | : 2007 |
Genre | : Integrated circuits |
ISBN | : UOM:39015048083664 |
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2016 IEEE International Interconnect Technology Conference Advanced Metallization Conference IITC AMC
![2016 IEEE International Interconnect Technology Conference Advanced Metallization Conference IITC AMC](https://youbookinc.com/wp-content/uploads/2024/06/cover.jpg)
Author | : Anonim |
Publsiher | : Unknown |
Total Pages | : 135 |
Release | : 2016 |
Genre | : Interconnects (Integrated circuit technology) |
ISBN | : 150900386X |
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Advanced Metallization Conference 1999 AMC 1999 Volume 15
Author | : Mihal E. Gross |
Publsiher | : Mrs Conference Proceedings |
Total Pages | : 806 |
Release | : 2000 |
Genre | : Technology & Engineering |
ISBN | : CORNELL:31924087243428 |
Download Advanced Metallization Conference 1999 AMC 1999 Volume 15 Book in PDF, Epub and Kindle
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Advanced Metallization Conference 2004 AMC 2004
Author | : Darrell Erb |
Publsiher | : Unknown |
Total Pages | : 922 |
Release | : 2005 |
Genre | : Technology & Engineering |
ISBN | : UOM:39015062572832 |
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Advanced Metallization Conference 2008 AMC 2008
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Author | : Mehul Naik,Roey Shaviv,Takashi Yoda,Kazuyoshi Ueno |
Publsiher | : Materials Research Society |
Total Pages | : 769 |
Release | : 2009-01-01 |
Genre | : Technology & Engineering |
ISBN | : 1605111252 |
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The Advanced Metallization Conference - held in San Diego, California, and Tokyo, Japan - marked its 25th anniversary in 2008. These two sister conferences form a unique 'one conference at two sites' that focuses on the latest R&D and manufacturing results, as well as real-world integration and reliability data on the application of metallization and related technologies for advanced IC devices. Scientists and engineers from around the world came to listen and present state-of-the-art work in the field of ULSI interconnect technology including metallization, dielectrics, integration, packaging, design and vertical integration. A keynote address by Gary Patton, vice president, IBM Systems and Technology Group, on 'Leading-edge Silicon Technology through Innovation and Collaboration', is featured. Additional topics include: integration; metallization; materials and characterization; CMP and cleaning; 3D integration and packaging; low-k materials; and reliability and yield.
Advanced Metallization Conference 2009 AMC 2009 Volume 25
Author | : Daniel C. Edelstein,Stefan E. Schulz |
Publsiher | : Materials Research Society |
Total Pages | : 0 |
Release | : 2010-08-02 |
Genre | : Technology & Engineering |
ISBN | : 1605112186 |
Download Advanced Metallization Conference 2009 AMC 2009 Volume 25 Book in PDF, Epub and Kindle
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Advanced Metallization Conference 2007 AMC 2007 Volume 23
Author | : Andrew J. McKerrow,Yosi Sacham-Diamand,Shoso Shingubara,Yukihiro Shimogaki |
Publsiher | : Materials Research Society |
Total Pages | : 0 |
Release | : 2008-01-01 |
Genre | : Technology & Engineering |
ISBN | : 1558999922 |
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The Advanced Metallization Conference - held in Albany, New York, and Tokyo, Japan - marked its 24th anniversary in 2007. These two sister conferences form a unique "one conference at two sites" that focuses on latest R&D and manufacturing results, as well as real-world integration and reliability data on the application of metallization and related technologies for advanced IC devices. Scientists and engineers from around the world came to listen and present state-of-the-art work in the field of ULSI interconnect technology including metallization, dielectrics, integration, packaging, design and vertical integration. Great progress has been made in ULSI metallization, but new challenges in performance, reliability and integration are expected as dimension continues to shrink. The importance of continued basic research in nanoscience and technology, using either metal wires or new materials such as carbon nanotubes, was declared key to the future of ULSI interconnects.
Advanced Metallization Conference 2002 AMC 2002
Author | : Anonim |
Publsiher | : Unknown |
Total Pages | : 920 |
Release | : 2003 |
Genre | : Integrated circuits |
ISBN | : CORNELL:31924096700954 |
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