Conference On Clean Surfaces

The Fourth International Conference on the Structure of Surfaces provides a forum for the report of new results and less the review of the status of surface structure and the relationship between surface and interface structure and physical or chemical properties of interest. Also within the scope of the meeting are novel experimental and theoretical approaches for the determination of surface and interface structures, computer simulation of dynamic processes and new developments in instrumentation.

Semiconductors and Semimetals

This volume documents the Proceedings of the 5th and 6th Symposia on Particles on Surfaces: Detection, Adhesion and Removal, held under the aegis of the Fine Particle Society in Chicago (May 6--9, 1996) and Dallas (April 1--3, 1998), respectively. The technical programs clearly reflected an interest and need to ameliorate the existing methods and to devise new and more efficient ways to detect, analyze and characterize particles on surfaces. The removal of particles from a host of surfaces was especially highlighted; the need to remove smaller and smaller particles was particularly underscored. All manuscripts included in this volume were properly peer reviewed and all were revised before inclusion in this volume. Thus, this book is not a mere collection of unreviewed papers, but represents information that has passed peer scrutiny. Furthermore, the authors of the 5th Symposium were asked to update the information. So, the information presented in this book should be as fresh and up-to-date as possible. This volume is divided into two parts: Part 1. General Papers and Part 2. Particle Adhesion and Removal. The topics covered include: high-sensitivity rapid detection of particles; detection of particles using evanescent wave scattering; particles on the backside of wafers; particle shedding from fluid-handling components; dynamics of particle adhesion; particle dispersion/aggregation; precision cleaning; and particle removal by surfactants, supercritical fluids, hydrodynamic forces, high-speed droplet impinging, megasonic, CO2 blasting, CO2 snow, argon aerosol, lasers, microcluster beams, brush and chemical-mechanical methods. This volume offers bountiful information and represent a current commentary on the R&D activity taking place in the area of particles on surfaces, particularly particle removal from a variety of surfaces.

The issues addressed by the Sixth International Symposium on the Ultra Clean Processing of Silicon Surfaces included all aspects of ultra-clean Si-technology, cleaning and contamination control in both front-end-of-line (FEOL) and back-end-of-line (BEOL) processing. Volume is indexed by Thomson Reuters CPCI-S (WoS). This covered studies of Si-surface chemistry and topography and its relationship to device performance and process yield, cleaning in relationship to new gate stacks, cleaning at the interconnect level, resist stripping and polymer removal, cleaning and contamination control of various new materials, wafer backside cleaning and cleaning following Chemical-Mechanical-Polishing (CMP).

Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal aspects. This revised edition includes the developments of the last ten years to accommodate a continually involving industry, addressing new technologies and materials, such as germanium and III-V compound semiconductors, and reviewing the various techniques and methods for cleaning and surface conditioning. Chapters include numerous examples of cleaning technique and their results. The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination. The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others. Focuses on cleaning techniques including wet, plasma and other surface conditioning techniques used to manufacture integrated circuits Reliable reference for anyone that manufactures integrated circuits or supplies the semiconductor and microelectronics industries Covers processes and equipment, as well as new materials and changes required for the surface conditioning process