Efficient Test Methodologies For High Speed Serial Links

Efficient Test Methodologies for High-Speed Serial Links describes in detail several new and promising techniques for cost-effectively testing high-speed interfaces with a high test coverage. One primary focus of Efficient Test Methodologies for High-Speed Serial Links is on efficient testing methods for jitter and bit-error-rate (BER), which are widely used for quantifying the quality of a communication system. Various analysis as well as experimental results are presented to demonstrate the validity of the presented techniques.

Efficient Test Methodologies for High-Speed Serial Links describes in detail several new and promising techniques for cost-effectively testing high-speed interfaces with a high test coverage. One primary focus of Efficient Test Methodologies for High-Speed Serial Links is on efficient testing methods for jitter and bit-error-rate (BER), which are widely used for quantifying the quality of a communication system. Various analysis as well as experimental results are presented to demonstrate the validity of the presented techniques.

This book introduces readers to the design of adaptive equalization solutions integrated in standard CMOS technology for high-speed serial links. Since continuous-time equalizers offer various advantages as an alternative to discrete-time equalizers at multi-gigabit rates, this book provides a detailed description of continuous-time adaptive equalizers design - both at transistor and system levels-, their main characteristics and performances. The authors begin with a complete review and analysis of the state of the art of equalizers for wireline applications, describing why they are necessary, their types, and their main applications. Next, theoretical fundamentals of continuous-time adaptive equalizers are explored. Then, new structures are proposed to implement the different building blocks of the adaptive equalizer: line equalizer, loop-filters, power comparator, etc. The authors demonstrate the design of a complete low-power, low-voltage, high-speed, continuous-time adaptive equalizer. Finally, a cost-effective CMOS receiver which includes the proposed continuous-time adaptive equalizer is designed for 1.25 Gb/s optical communications through 50-m length, 1-mm diameter plastic optical fiber (POF).

Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The first volume, EDA for IC System Design, Verification, and Testing, thoroughly examines system-level design, microarchitectural design, logical verification, and testing. Chapters contributed by leading experts authoritatively discuss processor modeling and design tools, using performance metrics to select microprocessor cores for IC designs, design and verification languages, digital simulation, hardware acceleration and emulation, and much more. Save on the complete set.

Wafer-scale integration has long been the dream of system designers. Instead of chopping a wafer into a few hundred or a few thousand chips, one would just connect the circuits on the entire wafer. What an enormous capability wafer-scale integration would offer: all those millions of circuits connected by high-speed on-chip wires. Unfortunately, the best known optical systems can provide suitably ?ne resolution only over an area much smaller than a whole wafer. There is no known way to pattern a whole wafer with transistors and wires small enough for modern circuits. Statistical defects present a ?rmer barrier to wafer-scale integration. Flaws appear regularly in integrated circuits; the larger the circuit area, the more probable there is a ?aw. If such ?aws were the result only of dust one might reduce their numbers, but ?aws are also the inevitable result of small scale. Each feature on a modern integrated circuit is carved out by only a small number of photons in the lithographic process. Each transistor gets its electrical properties from only a small number of impurity atoms in its tiny area. Inevitably, the quantized nature of light and the atomic nature of matter produce statistical variations in both the number of photons de?ning each tiny shape and the number of atoms providing the electrical behavior of tiny transistors. No known way exists to eliminate such statistical variation, nor may any be possible.

Modern electronics testing has a legacy of more than 40 years. The introduction of new technologies, especially nanometer technologies with 90nm or smaller geometry, has allowed the semiconductor industry to keep pace with the increased performance-capacity demands from consumers. As a result, semiconductor test costs have been growing steadily and typically amount to 40% of today's overall product cost. This book is a comprehensive guide to new VLSI Testing and Design-for-Testability techniques that will allow students, researchers, DFT practitioners, and VLSI designers to master quickly System-on-Chip Test architectures, for test debug and diagnosis of digital, memory, and analog/mixed-signal designs. Emphasizes VLSI Test principles and Design for Testability architectures, with numerous illustrations/examples. Most up-to-date coverage available, including Fault Tolerance, Low-Power Testing, Defect and Error Tolerance, Network-on-Chip (NOC) Testing, Software-Based Self-Testing, FPGA Testing, MEMS Testing, and System-In-Package (SIP) Testing, which are not yet available in any testing book. Covers the entire spectrum of VLSI testing and DFT architectures, from digital and analog, to memory circuits, and fault diagnosis and self-repair from digital to memory circuits. Discusses future nanotechnology test trends and challenges facing the nanometer design era; promising nanotechnology test techniques, including Quantum-Dots, Cellular Automata, Carbon-Nanotubes, and Hybrid Semiconductor/Nanowire/Molecular Computing. Practical problems at the end of each chapter for students.

This book constitutes the refereed proceedings of the 13th Conference on Advanced Computer Architecture, ACA 2020, held in Kunming, China, in August 2020. Due to the COVID-19 pandemic the conference was held online. The 24 revised full papers presented were carefully reviewed and selected from 105 submissions. The papers of this volume are organized in topical sections on: interconnection network, router and network interface architecture; accelerator-based, application-specific and reconfigurable architecture; processor, memory, and storage systems architecture; model, simulation and evaluation of architecture; new trends of technologies and applications.