Electronics Sub Assemblies And Active Components

Please note this is a Short Discount publication. Access both contact and company information on all 4950 European manufacturers, distributors and agents for 550 electronics components and sub–assembly product classifications throughout West and East Europe in one comprehensive Volume. Applications: • Sourcing of specific product types through local distributors or manufacturers • Location of new regional channels of distribution or identification of new European business partners • Competitor tracking • Sales lead generation Entries include: • Key names executives • Full address, telephone and fax details • Size indications including number of employees • Products • Manufacturers represented and agency status

This is a three-in-one compendium of sources and resources which draws on more than a decade of experience in sourcing and analyzing market and business information. It covers over 1000 key sources and highlights the best buys.

The objective of this publication is to provide a 'one stop' guide to business information, insofar as that is possible within the confines of a useable book. It aims to give guidance on both the published and organisational sources relevant to the needs of the non-professional business researcher and provides a listing of 'worthwhile' references and contacts. As previously, the Directory is organised so that both published sources and information centres are grouped together under their applicable Standard Industrial Classification (SIC) number and heading. This new edition also incorporates NACE classification and correlation tables. The second category again includes those UK and pan-national organisations which focus on specific, discrete industry sectors, which limits the number of organisational sources in the directory to those that are 'most worthwhile'.

Complete with coverage of the latest microwave and electro-optic components, the new edition of this classic reference meets the needs of all engineers who design, manufacture, and use active components in all categories of electronic systems. Includes data on the full range of semiconductors, guidelines for speed-power-density-cost tradeoffs, architectures, and noise reduction techniques, plus sections on microprocessors and microcontrollers. 700 illustrations.

The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.