High Cycle Fatigue Of Al And Cu Thin Films By A Novel High Throughput Method

In the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for thin films on Si substrate is presented. The specialty of this method is to test one sample at different strain amplitudes at the same time and measure an entire lifetime curve with only one experiment.

Originally published in 1969, this book provides a sustained examination of the idea of the individual person as of supreme worth in the language of analytical philosophy. An important contribution to debates in moral philosophy, it will be of use to students in the philosophy of religion and education and to those who are interested in the contribution which philosophical analysis can make to the understanding of traditional moral and political ideas.

Custom built setups were developed to investigate micro samples during quasistatic and cyclic testing in tension, compression and bending. Micro molded CuAl10Ni5Fe4-samples showed similar fatigue behavior compared to macroscopic samples due to both the sample size and microstructure being scaled down with the manufacturing process. Results from cyclic three-point bending tests on micro molded 3Y-TZP suggested that a minimum crack extension is necessary to develop cyclically degradable shielding.

To determine the characteristics and properties of cellular solids for an application, and to allow a systematic practical use by means of correlations and modelling approaches, we perform experimental investigations and develop numerical methods. In view of coupled multi-physics simulations, we employ the phase-field method. Finally, the applicability is demonstrated exemplarily for open-cell metal foams, providing qualitative and quantitative comparison with experimental data.