Introduction To Microelectromechanical Microwave Systems

Annotation The second edition covers the latest in fabrication technologies, actuation mechanisms, packaging, switching, resonator design, and microwave and wireless applications. This practical book steers readers past the drawbacks and towards the benefits of integrating RF/microwave MEMS into communications equipment

Microelectromechanical systems (MEMS) refer to a collection of micro-sensors and actuators, which can react to environmental change under micro- circuit control. The integration of MEMS into traditional Radio Frequency (RF) circuits has resulted in systems with superior performance levels and lower manufacturing costs. The incorporation of MEMS based fabrication technologies into micro and millimeter wave systems offers viable routes to ICs with MEMS actuators, antennas, switches and transmission lines. The resultant systems operate with an increased bandwidth and increased radiation efficiency and have considerable scope for implementation within the expanding area of wireless personal communication devices. This text provides leading edge coverage of this increasingly important area and highlights the overlapping information requirements of the RF and MEMS research and development communities. * Provides an introduction to micromachining techniques and their use in the fabrication of micro switches, capacitors and inductors * Includes coverage of MEMS devices for wireless and Bluetooth enabled systems Essential reading for RF Circuit design practitioners and researchers requiring an introduction to MEMS technologies, as well as practitioners and researchers in MEMS and silicon technology requiring an introduction to RF circuit design.

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.

Receivers systems are considered the core of electronic warfare (EW) intercept systems. Without them, the fundamental purpose of such systems is null and void. This book considers the major elements that make up receiver systems and the receivers that go in them. This resource provides system design engineers with techniques for design and development of EW receivers for modern modulations (spread spectrum) in addition to receivers for older, common modulation formats. Each major module in these receivers is considered in detail. Design information is included as well as performance tradeoffs of various components. Major factors that influence the functioning of the modules are identified and discussed. Key performance parameters are identified as well, and approaches to achieving design goals are considered.

The operational theme permeating most definitions of the IoT concept, is the wireless communication of networked objects, in particular, smart sensing devices and machines, exchanging data a la Internet. In this book, a detailed look is taken at the fundamental principles of devices and techniques whose exploitation will facilitate the development of compact, power-efficient, autonomous, smart, networked sensing nodes underlying and encompassing the emerging IoT era.The book provides an understanding of nanoelectromechanical quantum circuits and systems (NEMX), as exemplified by firstly the uncovering of their origins, impetus and motivation, and secondly by developing an understanding of their device physics, including, the topics of actuation, mechanical vibration and sensing. Next the fundamentals of key devices, namely, MEMS/NEMS switches, varactors and resonators are covered, including a wide range of implementations. The book then looks at their energy supply via energy harvesting, as derived from wireless energy and mechanical vibrations. Finally, after an introduction to the fundamentals of IoT networks and nodes, the book concludes with an exploration of how the NEMX components are encroaching in a variety of emerging IoT applications.

Microelectromechanical Systems (MEMS) stand poised for the next major breakthrough in the silicon revolution that began with the transistor in the 1960s and has revolutionized microelectronics. MEMS allow one to not only observe and process information of all types from small scale systems, but also to affect changes in systems and the environment at that scale. “RF MEMS Switches and Integrated Switching Circuits” builds on the extensive body of literature that exists in research papers on analytical and numerical modeling and design based on RF MEMS switches and micromachined switching circuits, and presents a unified framework of coverage. This volume includes, but is not limited to, RF MEMS approaches, developments from RF MEMS switches to RF switching circuits, and MEMS switch components in circuit systems. This book also: -Presents RF Switches and switching circuit MEMS devices in a unified framework covering all aspects of engineering innovation, design, modeling, fabrication, control and experimental implementation -Discusses RF switch devices in detail, with both system and component-level circuit integration using micro- and nano-fabrication techniques -Includes an emphasis on design innovation and experimental relevance rather than basic electromagnetic theory and device physics “RF MEMS Switches and Integrated Switching Circuits” is perfect for engineers, researchers and students working in the fields of MEMS, circuits and systems and RFs.

MICROWAVE INTEGRATED CIRCUIT COMPONENTS DESIGN THROUGH MATLAB® This book teaches the student community microwave integrated circuit component design through MATLAB®, helping the reader to become conversant in using codes and, thereafter, commercial software for verification purposes only. Microwave circuit theory and its comparisons, transmission line networks, S-parameters, ABCD parameters, basic design parameters of planar transmission lines (striplines, microstrips, slot lines, coplanar waveguides, finlines), filter theory, Smith chart, inverted Smith chart, stability circles, noise figure circles and microwave components, are thoroughly explained in the book. The chapters are planned in such a way that readers get a thorough understanding to ensure expertise in design. Aimed at senior undergraduates, graduates and researchers in electrical engineering, electromagnetics, microwave circuit design and communications engineering, this book: • Explains basic tools for design and analysis of microwave circuits such as the Smith chart and network parameters • Gives the advantage of realizing the output without wiring the circuit by simulating through MATLAB code • Compares distributed theory with network theory • Includes microwave components, filters and amplifiers S. Raghavan was a Senior Professor (HAG) in the Department of Electronics and Communication Engineering, National Institute of Technology (NIT), Trichy, India and has 39 years of teaching and research experience at the Institute. His interests include: microwave integrated circuits, RF MEMS, Bio MEMS, metamaterial, frequency selective surfaces (FSS), substrate integrated waveguides (SIW), biomedical engineering and microwave engineering. He has established state-of-the-art MICs and microwave research laboratories at NIT, Trichy with funding from the Indian government. He is a Fellow/Senior Member in more than 24 professional societies including: IEEE (MTT, EMBS, APS), IETE, IEI, CSI, TSI, ISSS, ILA and ISOI. He is twice a recipient of the Best Teacher Award, and has received the Life Time Achievement Award, Distinguished Professor of Microwave Integrated Circuit Award and Best Researcher Award.