Istfa 2014
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ISTFA 2014
Author | : A. S. M. International,International Symposium for Testing and Failure Analysis |
Publsiher | : ASM International |
Total Pages | : 561 |
Release | : 2014-11-01 |
Genre | : Technology & Engineering |
ISBN | : 9781627080743 |
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This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.
ISTFA 2019 Proceedings of the 45th International Symposium for Testing and Failure Analysis
Author | : Anonim |
Publsiher | : ASM International |
Total Pages | : 540 |
Release | : 2019-12-01 |
Genre | : Technology & Engineering |
ISBN | : 9781627082730 |
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The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
ISTFA 2017 Proceedings from the 43rd International Symposium for Testing and Failure Analysis
Author | : Anonim |
Publsiher | : ASM International |
Total Pages | : 135 |
Release | : 2017-12-01 |
Genre | : Technology & Engineering |
ISBN | : 9781627081511 |
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The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
ISTFA 2018 Proceedings from the 44th International Symposium for Testing and Failure Analysis
Author | : Anonim |
Publsiher | : ASM International |
Total Pages | : 135 |
Release | : 2018-12-01 |
Genre | : Electronic Book |
ISBN | : 9781627080996 |
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The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
Microelectronics Fialure Analysis Desk Reference Seventh Edition
Author | : Tejinder Gandhi |
Publsiher | : ASM International |
Total Pages | : 750 |
Release | : 2019-11-01 |
Genre | : Technology & Engineering |
ISBN | : 9781627082464 |
Download Microelectronics Fialure Analysis Desk Reference Seventh Edition Book in PDF, Epub and Kindle
The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Metrology and Diagnostic Techniques for Nanoelectronics
Author | : Zhiyong Ma,David G. Seiler |
Publsiher | : CRC Press |
Total Pages | : 843 |
Release | : 2017-03-27 |
Genre | : Science |
ISBN | : 9781351733946 |
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Nanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques.
Hardware Security
Author | : Mark Tehranipoor |
Publsiher | : Springer Nature |
Total Pages | : 538 |
Release | : 2024 |
Genre | : Electronic Book |
ISBN | : 9783031586873 |
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3D Microelectronic Packaging
Author | : Yan Li,Deepak Goyal |
Publsiher | : Springer |
Total Pages | : 463 |
Release | : 2017-01-20 |
Genre | : Technology & Engineering |
ISBN | : 9783319445861 |
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This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.