Materials Science Of High Temperature Polymers For Microelectronics

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

The topics covered in this proceedings volume include: Synthesis, characterization and processing (including some novel approaches) of a variety of polyimides and other high temperature polymers; structure-property relationships; segmental dynamics in polyimide materials; photoalignable polyimides; photoconductivity and photosensitivity of polyimides; ultrafiltration membranes from polyetherimide; polymer materials for nonlinear optical applications; alignment of SWNTs in rigid-rod polymer compositions; surface modification of polyimide; adhesion of Cu to polyimide surfaces; and polyimide erosion in a low Earth orbit space environment.

Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. Reviews the latest research, development and future prospective of polyimides Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers Presents a highly organized work that is composed of different sections that are easily compared

A gathering of leading experts in the field of high temperature polymers unite in this exciting compilation to discuss applications and marketing projections in this ever-expanding field. The authors represent a diverse group of academicians, industrial researchers, consultants, managers, and marketing forecasters and present a broad-based view of polymer technology. Topics include: liquid crystalline polymers; high temperature polyimides; heat-resistant engineering polymers; and high temperature organic polymers, including their chemistry and key functional properties in moldings, films, fibers, and coatings, as well as applications in electronics, packaging, and friction/wear. This is an essential source of data on high temperature polymers.

This book presents an overview of polymer nanocomposites for use in various high-temperature applications. Specifically, it focuses on the structure and physical properties of nanocomposites based on heterocyclic matrices derived from nitrile monomers such as cyanate esters or phthalonitriles. Due to increasing interest in new heat-resistant, lightweight materials for use in extreme conditions, such as in aeronautics, microelectronics, and various industrial machinery, the high thermal stability of heterocyclic polymer networks, in particular, has attracted much attention from materials researchers and engineers. Featuring a comprehensive review of the most recent advances in research on the structure and physical properties of these promising high-temperature polymer nanocomposites, this book will be of particular interest to materials scientists and engineers working throughout the fields of aeronautical and microelectronic engineering. In general, this book is intended for use by researchers of composite materials and specialists engaged in material selection for work in extreme conditions; for students specializing in materials science; for polymer physicists, and for university libraries.