Mems Design Fabrication Characterization And Packaging

Presenting unified coverage of the design and modeling of smart micro- and macrosystems, this book addresses fabrication issues and outlines the challenges faced by engineers working with smart sensors in a variety of applications. Part I deals with the fundamental concepts of a typical smart system and its constituent components. Preliminary fabrication and characterization concepts are introduced before design principles are discussed in detail. Part III presents a comprehensive account of the modeling of smart systems, smart sensors and actuators. Part IV builds upon the fundamental concepts to analyze fabrication techniques for silicon-based MEMS in more detail. Practicing engineers will benefit from the detailed assessment of applications in communications technology, aerospace, biomedical and mechanical engineering. The book provides an essential reference or textbook for graduates following a course in smart sensors, actuators and systems.

Microelectromechanical systems (MEMS) refer to a collection of micro-sensors and actuators, which can react to environmental change under micro- circuit control. The integration of MEMS into traditional Radio Frequency (RF) circuits has resulted in systems with superior performance levels and lower manufacturing costs. The incorporation of MEMS based fabrication technologies into micro and millimeter wave systems offers viable routes to ICs with MEMS actuators, antennas, switches and transmission lines. The resultant systems operate with an increased bandwidth and increased radiation efficiency and have considerable scope for implementation within the expanding area of wireless personal communication devices. This text provides leading edge coverage of this increasingly important area and highlights the overlapping information requirements of the RF and MEMS research and development communities. * Provides an introduction to micromachining techniques and their use in the fabrication of micro switches, capacitors and inductors * Includes coverage of MEMS devices for wireless and Bluetooth enabled systems Essential reading for RF Circuit design practitioners and researchers requiring an introduction to MEMS technologies, as well as practitioners and researchers in MEMS and silicon technology requiring an introduction to RF circuit design.

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

Latest Edition: 3D Printing and Additive Manufacturing: Principles and Applications. Fifth Edition of Rapid Prototyping. Rapid prototyping (RP) has revolutionized how prototypes are made and small batch manufacturing is carried out. With rapid prototyping, the strategies used to produce a part change a number of important considerations and limitations previously faced by tool designers and engineers. Now in its third edition, this textbook is still the definitive text on RP. It covers the key RP processes, the available models and specifications, and their principles, materials, advantages and disadvantages. Examples of application areas in design, planning, manufacturing, biomedical engineering, art and architecture are also given. The book includes several related problems so that the reader can test his or her understanding of the topics. New to this edition, the included CD-ROM presents animated illustrations of the working principles of today's key RP processes.

The second edition of this standard-setting handbook provides and all-encompassing reference for the practicing engineer in industry, government, and academia, with relevant background and up-to-date information on the most important topics of modern mechanical engineering. These topics include modern manufacturing and design, robotics, computer engineering, environmental engineering, economics, patent law, and communication/information systems. The final chapter and appendix provide information regarding physical properties and mathematical and computational methods. New topics include nanotechnology, MEMS, electronic packaging, global climate change, electric and hybrid vehicles, and bioengineering.