Molecular Beam Epitaxy Growth And Characterization Of Zno Based Layers And Heterostructures

Semiconductors are at the heart of modern living. Almost everything we do, be it work, travel, communication, or entertainment, all depend on some feature of semiconductor technology. Comprehensive Semiconductor Science and Technology, Six Volume Set captures the breadth of this important field, and presents it in a single source to the large audience who study, make, and exploit semiconductors. Previous attempts at this achievement have been abbreviated, and have omitted important topics. Written and Edited by a truly international team of experts, this work delivers an objective yet cohesive global review of the semiconductor world. The work is divided into three sections. The first section is concerned with the fundamental physics of semiconductors, showing how the electronic features and the lattice dynamics change drastically when systems vary from bulk to a low-dimensional structure and further to a nanometer size. Throughout this section there is an emphasis on the full understanding of the underlying physics. The second section deals largely with the transformation of the conceptual framework of solid state physics into devices and systems which require the growth of extremely high purity, nearly defect-free bulk and epitaxial materials. The last section is devoted to exploitation of the knowledge described in the previous sections to highlight the spectrum of devices we see all around us. Provides a comprehensive global picture of the semiconductor world Each of the work's three sections presents a complete description of one aspect of the whole Written and Edited by a truly international team of experts

Zinc oxide (ZnO) in its nanostructured form is emerging as a promising material with great potential for the development of many smart electronic devices. This book presents up-to-date information about various synthesis methods to obtain device-quality ZnO nanostructures. It describes both high-temperature (over 100° C) and low-temperature (under 100° C) approaches to synthesizing ZnO nanostructures; device applications for technical and medical devices, light-emitting diodes, electrochemical sensors, nanogenerators, and photodynamic therapy; and the concept of self-powered devices and systems using ZnO nanostructures. The book emphasizes the utilization of non-conventional substrates such as plastic, paper, and textile as new platforms for developing electronics.

For the electronic and optoelectronic device realization a precise control of the electrical properties in the utilized material is a very important issue. Doping profiles in realized p-njunctions influence the functionality of the devices. The morphological and crystal properties of a device material directly influence the electrical ones. Dislocations present in a region of p-n-junctions can short circuit them leading to malfunctions. Too rough surfaces during epitaxial growth could lead to inhomogeneities in a single or multiple quantum wells and superlattices. The main goal of the present work was to provide the basis for a reliable p-type doping of ZnO grown by molecular beam epitaxy. Firstly, the well established heteroepitaxial growth on c-sapphire substrates has been employed. Based on the theoretical and experimental works, suggesting nitrogen to be the impurity that builds the most shallow acceptor level in ZnO comparing to other group-V elements, it has been implied as a dopant. To generate reactive nitrogen atoms an rf-plasma source has been utilized in the MBE process. The resulting samples have been characterized by such methods as AFM, XRD, TEM, PL spectroscopy, temperature domain Hall measurements (TDHM) and ECV-profiling. First results of TDHM have shown that even in undoped samples the temperature dependencies of the electron mobility and carrier concentration have regions which are difficult to interpret. It is necessary to fit them with theoretical curves in order to extract the correct values. This task has proven to be very difficult. The complicated character of the dependencies has been explained in terms of the multilayer conduction model dividing a layer in thin interfacial region with mobility and carrier concentration μ1 and n1 respectivly and bulk region with a higher mobility μ2 and lower carrier concentration n2. The electrical transport in the bulk region has been modeled in terms of the general scattering theory in polar semiconductors. Such scattering mechanisms as scattering on polar-optical phonons, piezoelectric phonons, acoustic deformation potential, strain induced fields, dislocations, ionized and neutral impurities have been taken into account. Two cases have been considered to model transport in the interfacial region: 1) transport takes place in the conduction band of a highly doped degenerate semiconductor; 2) transport takes place in the impurity band formed by intermediate concentration of impurities and in conduction band in parallel. In the second case transport at the interface in conduction band has been neglected in the region of the low temperatures due to the impurities freeze-out and carrier concentration has been taken temperature independent like in the first case. To investigate experimentally the transport character in these two regions independently a mobility-spectrum analysis has been conducted. Theoretical results utilizing the two models have been compared with experimentally extracted mobility and carrier concentration in the interfacial region. It has been concluded that the concentration of donors in the layers is not high enough for the impurity band to merge with the conduction band and the second model is more consistent. The theoretically acquired donor concentration profiles have been compared with ECV-profiles. The agreement is very good. Simulations have revealed a shallow donor state with the ionization energy of approximately 45 meV . In the literature, this donor state in ZnO is attributed to hydrogen. However, due to the high diffusion mobility of hydrogen in ZnO, an annealing process would obviously decrease the carrier concentration in the samples which has not been the case. It has been suggested that the main donor centers are the electrically active crystal point defects generated by dislocations. Layers doped with nitrogen have been grown at very low temperatures (≈ 200°C) and at temperatures ranging from 400°C to 500°C, which are optimal for the epitaxial growth of ZnO. The samples grown at low temperatures are single crystalline with mosaic structure. In both cases, the introduction of the dopant increased the carrier concentration. This has been accounted for a bad crystal quality resulting in the inhomogeneous incorporation of nitrogen and for high background donor concentration due to the high dislocations densities. Additionally, the incorporation of acceptor centers shifts the Fermi-level increasing the formation probability of the compensating point defects. The analysis of TDHM showed an inconsistency of the one donor level model in the case of nitrogen doped samples. This fact and the decrease in the carrier concentration after annealing at 800°C for 30 minutes in ambient air can be explained by nitrogen forming donor-like defect complexes. In an attempt to improve the crystal quality of the heteroepitaxial layers, 15 periods of a ZnO/Zn0.6Mg0.4O superlattice structure have been inserted between the conventional double HT-MgO/LT-ZnO buffer and a main HT-ZnO layer. TDHM has revealed a very high mobility close to the values measured in a bulk ZnO for the temperature range of 20 - 300 K. However, TEM investigations of the samples have not indicated any decrease in the dislocation density comparing with the similar samples without a superlattice. Such a high mobility has been attributed to an electron transport in the superlattice structure. Heteroepitaxial growth of high quality ZnO-layers has proven to be challenging leaving the homoepitaxial growth as the only possibility to obtain the epitaxial layers with the best structural and electrical properties. The hydrothermally grown bulk ZnO substrates from two supplying companies, CrysTec and TokyoDenpa, have been employed for homoepitaxy. The substrates from CrysTec have not been epi-ready. Although AFM images reveal very flat surface, this has been damaged by the process of the chemomechanical polishing. This damaged layer must be removed. This has been achieved by the thermal annealing for 3 hours at 1050°C in ambient air. The thermally treated surfaces resulted in atomically flat terraces. XRD measurements have indicated an improvement of the crystal quality after annealing. The resistivity of the bulk substrates decreased after the thermal treatment due to out-diffusion of the compensating Li atoms letting Al, Ga and In atoms to contribute to conduction. After the longer annealing processes the etch-pits have been discovered on O-polar faces. The same features could be achieved by the chemical etching in a nitric acid on Zn-polar faces. The density of the threading dislocations on both polar faces for both types of substrates calculated by the etch-pit density investigation is about 105 1/cm2. Further the thermally treated substrates with atomically flat terraces have been utilized for homoepitaxy. The differences in growth kinetics during the molecular beam epitaxy on such substrates with the improved surface quality depending on their polarity have been investigated by RHEED measurements. The growth on a Zn-polar face has a 3D-character independently on a supplier. Morphologies of the resulting O- and Zn-polar layers have shown to be different. This has been explained by the presence of dangling bonds on Opolar face and thus, shorter diffusion time of the impinging Zn atoms on the surface. XRD and TEM measurements have shown a perfect crystal quality of the overgrown layers. The PL spectra of homoepitaxial layers are governed by the donor impurities diffused from the substrates. Considering the SIMS measurements of homoepitaxial layers found in the literature it has been concluded that the diffusion of donors in the layers grown on Zn-polar faces takes less effect then for the O-polar films. This conclusion has enforced the utilization of Zn-polar substrates supplied by CrysTec for the experiments with nitrogen doping of ZnO because of their affordable price. The electrical properties measured by ECV-profiling in series of homoepitaxial layers with varied growth parameters have shown an increase of the carrier concentration with the nitrogen incorporation. In addition, it has also been shown that the resulting electrical properties near the interface are governed mostly by the initial properties of the substrates. With increasing thickness of the layers carrier concentration saturated to the values of around 1016 1/cm3. The recent successful realization of the p-type MgZnO layers on TokyoDenpa substrates by researchers from Japan suggests switching to the p-type doped alloys because the above discussed results indicate that p-type doping with nitrogen of a pure ZnO is very difficult or even impossible. This is due to a rather fundamental reason: the formation of the compensating donor centers with the incorporation of acceptor atoms. As the first step in the future works, it is obvious to try to reproduce the results of the ZnMgO p-type doping with nitrogen employing growth on ZnO substrates.

The book is a history of Molecular Beam Epitaxy (MBE) as applied to the growth of semiconductor thin films (note that it does not cover the subject of metal thin films). It begins by examining the origins of MBE, first of all looking at the nature of molecular beams and considering their application to fundamental physics, to the development of nuclear magnetic resonance and to the invention of the microwave MASER. It shows how molecular beams of silane (SiH4) were used to study the nucleation of silicon films on a silicon substrate and how such studies were extended to compound semiconductors such as GaAs. From such surface studies in ultra-high vacuum the technique developed into a method of growing high quality single crystal films of a wide range of semiconductors. Comparing this with earlier evaporation methods of deposition and with other epitaxial deposition methods such as liquid phase and vapour phase epitaxy (LPE and VPE). The text describes the development of MBE machines from the early 'home-made' variety to that of commercial equipment and show how MBE was gradually refined to produce high quality films with atomic dimensions. This was much aided by the use of various in-situ surface analysis techniques, such as reflection high energy electron diffraction (RHEED) and mass spectrometry, a feature unique to MBE. It looks at various modified versions of the basic MBE process, then proceed to describe their application to the growth of so-called 'low-dimensional structures' (LDS) based on ultra-thin heterostructure films with thickness of order a few molecular monolayers. Further chapters cover the growth of a wide range of different compounds and describe their application to fundamental physics and to the fabrication of electronic and opto-electronic devices. The authors study the historical development of all these aspects and emphasise both the (often unexpected) manner of their discovery and development and the unique features which MBE brings to the growth of extremely complex structures with monolayer accuracy.

Molecular Beam Epitaxy (MBE): From Research to Mass Production, Second Edition, provides a comprehensive overview of the latest MBE research and applications in epitaxial growth, along with a detailed discussion and ‘how to’ on processing molecular or atomic beams that occur on the surface of a heated crystalline substrate in a vacuum. The techniques addressed in the book can be deployed wherever precise thin-film devices with enhanced and unique properties for computing, optics or photonics are required. It includes new semiconductor materials, new device structures that are commercially available, and many that are at the advanced research stage. This second edition covers the advances made by MBE, both in research and in the mass production of electronic and optoelectronic devices. Enhancements include new chapters on MBE growth of 2D materials, Si-Ge materials, AIN and GaN materials, and hybrid ferromagnet and semiconductor structures. Condenses the fundamental science of MBE into a modern reference, speeding up literature review Discusses new materials, novel applications and new device structures, grounding current commercial applications with modern understanding in industry and research Includes coverage of MBE as mass production epitaxial technology and how it enhances processing efficiency and throughput for the semiconductor industry and nanostructured semiconductor materials research community

Through their application in energy-efficient and environmentally friendly devices, zinc oxide (ZnO) and related classes of wide gap semiconductors, including GaN and SiC, are revolutionizing numerous areas, from lighting, energy conversion, photovoltaics, and communications to biotechnology, imaging, and medicine. With an emphasis on engineering a

Oxide-based materials and structures are becoming increasingly important in a wide range of practical fields including microelectronics, photonics, spintronics, power harvesting, and energy storage in addition to having environmental applications. This book provides readers with a review of the latest research and an overview of cutting-edge patents received in the field. It covers a wide range of materials, techniques, and approaches that will be of interest to both established and early-career scientists in nanoscience and nanotechnology, surface and material science, and bioscience and bioengineering in addition to graduate students in these areas. Features: Contains the latest research and developments in this exciting and emerging field Explores both the fundamentals and applications of the research Covers a wide range of materials, techniques, and approaches