Optical Interconnects For Data Centers

Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers. Summarizes the state-of-the-art in this emerging field Presents a comprehensive review of all the key aspects of deploying optical interconnects in data centers, from materials and components, to circuit boards and methods for integration Contains contributions that are drawn from leading international experts on the topic

Optical Interconnects in Future Data Center Networks covers optical networks and how they can be used to provide high bandwidth, energy efficient interconnects for future data centers with increased communication bandwidth requirements. This contributed volume presents an integrated view of the future requirements of the data centers and serves as a reference work for some of the most advanced solutions that have been proposed by major universities and companies. Collecting the most recent and innovative optical interconnects for data center networks that have been presented in the research community by universities and industries, this book is a valuable reference to researchers, students, professors and engineers interested in the domain of high performance interconnects and data center networks. Additionally, Optical Interconnects in Future Data Center Networks provides invaluable insights into the benefits and advantages of optical interconnects and how they can be a promising alternative for future data center networks.

In recent years, investments by cloud companies in mega data centers and associated network infrastructure has created a very active and dynamic segment in the optical components and modules market. Optical interconnect technologies at high speed play a critical role for the growth of mega data centers, which flood the networks with unprecedented amount of data traffic. Datacenter Connectivity Technologies: Principles and Practice provides a comprehensive and in-depth look at the development of various optical connectivity technologies which are making an impact on the building of data centers. The technologies span from short range connectivity, as low as 100 meters with multi-mode fiber (MMF) links inside data centers, to long distances of hundreds of kilometers with single-mode fiber (SMF) links between data centers.This book is the first of its kind to address various advanced technologies connecting data centers. It represents a collection of achievements and the latest developments from well-known industry experts and academic researchers active in this field.

This book introduces the reader to the optical switching technology for its application to data centers. In addition, it takes a picture of the status of the technology and system architecture evolution and of the research in the area of optical switching in data center. The book is organized in four parts: the first part is focused on the system aspects of optical switching in intra-data center networking, the second part is dedicated to describing the recently demonstrated optical switching networks, the third part deals with the latest technologies developed to enable optical switching and, finally, the fourth part of the book outlines the future prospects and trends.

It constitutes the refereed proceedings of the 4th Asian Supercomputing Conference, SCFA 2018, held in Singapore in March 2018. Supercomputing Frontiers will be rebranded as Supercomputing Frontiers Asia (SCFA), which serves as the technical programme for SCA18. The technical programme for SCA18 consists of four tracks: Application, Algorithms & Libraries Programming System Software Architecture, Network/Communications & Management Data, Storage & Visualisation The 20 papers presented in this volume were carefully reviewed nd selected from 60 submissions.

Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve “short line distances of the cm–mm order” and “large line counts of hundreds-thousands.” This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules. This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.

Silicon photonics uses chip-making techniques to fabricate photonic circuits. The emerging technology is coming to market at a time of momentous change. The need of the Internet content providers to keep scaling their data centers is becoming increasing challenging, the chip industry is facing a future without Moore’s law, while telcos must contend with a looming capacity crunch due to continual traffic growth. Each of these developments is significant in its own right. Collectively, they require new thinking in the design of chips, optical components, and systems. Such change also signals new business opportunities and disruption. Notwithstanding challenges, silicon photonics’ emergence is timely because it is the future of several industries. For the optical industry, the technology will allow designs to be tackled in new ways. For the chip industry, silicon photonics will become the way of scaling post-Moore’s law. New system architectures enabled by silicon photonics will improve large-scale computing and optical communications. Silicon Photonics: Fueling the Next Information Revolution outlines the history and status of silicon photonics. The book discusses the trends driving the datacom and telecom industries, the main but not the only markets for silicon photonics. In particular, developments in optical transport and the data center are discussed as are the challenges. The book details the many roles silicon photonics will play, from wide area networks down to the chip level. Silicon photonics is set to change the optical components and chip industries; this book explains how. Captures the latest research assessing silicon photonics development and prospects Demonstrates how silicon photonics addresses the challenges of managing bandwidth over distance and within systems Explores potential applications of SiP, including servers, datacenters, and Internet of Things

This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing.