Power Distribution Network Design Methodologies

A series of cogently written articles by 49 industry experts, this collection fills the void on Power Distribution Network (PDN) design procedures, and addresses such related topics as DC–DC converters, selection of bypass capacitors, DDR2 memory systems, powering of FPGAs, and synthesis of impedance profiles. Through these contributions from such leading companies as Sun Microsystems, Sanyo, IBM, Hewlett-Packard, Intel, and Rambus, readers will come to understand why books on power integrity are only now becoming available to the public and can relate these topics to current industry trends.

The Faraday Press Edition of István Novák's historic Power Distribution Network Design Methodologies brings to print important coverage of power system design topics including circuit board layout strategies, capacitor characterization and selection, controlled impedance design and guidance for system-level engineering. Power Distribution Network (PDN) design procedures are covered in practical detail-covering topics including the buck converter topology, the proper selection and placement of bypass capacitors, power requirements of memory systems, powering FPGAs and designing/controlling wideband power delivery impedances. As clock speeds and power density requirements progress, the challenges of a robust system design becomes more and more important. Power Distribution Network Design is a valuable resource for the global community of power supply designers.

As well as dealing with the planning and design of modern distribution systems, as opposed to more general aspects of transmission and generation, this second edition of Electricity Distribution Network Design (1989) updates its treatment of computer-based planning and reliability. It also covers the implications of international standards, network information systems and distribution automation.

A hands-on troubleshooting guide for VLSI network designers The primary goal in VLSI (very large scale integration) power network design is to provide enough power lines across a chip to reduce voltage drops from the power pads to the center of the chip. Voltage drops caused by the power network's metal lines coupled with transistor switching currents on the chip cause power supply noises that can affect circuit timing and performance, thus providing a constant challenge for designers of high-performance chips. Power Distribution Network Design for VLSI provides detailed information on this critical component of circuit design and physical integration for high-speed chips. A vital tool for professional engineers (especially those involved in the use of commercial tools), as well as graduate students of engineering, the text explains the design issues, guidelines, and CAD tools for the power distribution of the VLSI chip and package, and provides numerous examples for its effective application. Features of the text include: * An introduction to power distribution network design * Design perspectives, such as power network planning, layout specifications, decoupling capacitance insertion, modeling, and analysis * Electromigration phenomena * IR drop analysis methodology * Commands and user interfaces of the VoltageStorm(TM) CAD tool * Microprocessor design examples using on-chip power distribution * Flip-chip and package design issues * Power network measurement techniques from real silicon The author includes several case studies and a glossary of key words and basic terms to help readers understand and integrate basic concepts in VLSI design and power distribution.

This book proposes systemic design methodologies applied to electrical energy systems, in particular analysis and system management, modeling and sizing tools. It includes 8 chapters: after an introduction to the systemic approach (history, basics & fundamental issues, index terms) for designing energy systems, this book presents two different graphical formalisms especially dedicated to multidisciplinary devices modeling, synthesis and analysis: Bond Graph and COG/EMR. Other systemic analysis approaches for quality and stability of systems, as well as for safety and robustness analysis tools are also proposed. One chapter is dedicated to energy management and another is focused on Monte Carlo algorithms for electrical systems and networks sizing. The aim of this book is to summarize design methodologies based in particular on a systemic viewpoint, by considering the system as a whole. These methods and tools are proposed by the most important French research laboratories, which have many scientific partnerships with other European and international research institutions. Scientists and engineers in the field of electrical engineering, especially teachers/researchers because of the focus on methodological issues, will find this book extremely useful, as will PhD and Masters students in this field.

This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.

Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.