Proceedings Of The First International Symposium On Advanced Materials For Ulsi
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Proceedings of the First International Symposium on Advanced Materials for ULSI
Author | : Martin P. Scott,Yoichi Akasaka,Rafael Reif |
Publsiher | : Unknown |
Total Pages | : 260 |
Release | : 1988 |
Genre | : Integrated circuits |
ISBN | : UCAL:B4151888 |
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ULSI Science and Technology 1989
Author | : C. M. Osburn,John M. Andrews |
Publsiher | : Unknown |
Total Pages | : 804 |
Release | : 1989 |
Genre | : Integrated circuits |
ISBN | : CORNELL:31924072149259 |
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ULSI Process Integration
Author | : Cor L. Claeys |
Publsiher | : The Electrochemical Society |
Total Pages | : 408 |
Release | : 1999 |
Genre | : Computers |
ISBN | : 1566772419 |
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Reduced Thermal Processing for ULSI
Author | : R.A. Levy |
Publsiher | : Springer Science & Business Media |
Total Pages | : 444 |
Release | : 2012-12-06 |
Genre | : Science |
ISBN | : 9781461305415 |
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As feature dimensions of integrated circuits shrink, the associated geometrical constraints on junction depth impose severe restrictions on the thermal budget for processing such devices. Furthermore, due to the relatively low melting point of the first aluminum metallization level, such restrictions extend to the fabrication of multilevel structures that are now essential in increasing packing density of interconnect lines. The fabrication of ultra large scale integrated (ULSI) devices under thermal budget restrictions requires the reassessment of existing and the development of new microelectronic materials and processes. This book addresses three broad but interrelated areas. The first area focuses on the subject of rapid thermal processing (RTP), a technology that allows minimization of processing time while relaxing the constraints on high temperature. Initially developed to limit dopant redistribution, current applications of RTP are shown here to encompass annealing, oxidation, nitridation, silicidation, glass reflow, and contact sintering. In a second but complementary area, advances in equipment design and performance of rapid thermal processing equipment are presented in conjunction with associated issues of temperature measurement and control. Defect mechanisms are assessed together with the resulting properties of rapidly deposited and processed films. The concept of RTP integration for a full CMOS device process is also examined together with its impact on device characteristics.
Advanced Materials 95
Author | : Anwar-ul-Haq |
Publsiher | : Unknown |
Total Pages | : 744 |
Release | : 1996 |
Genre | : Materials science |
ISBN | : PSU:000055155137 |
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ULSI Process Integration II
Author | : Cor L. Claeys,Electrochemical Society. Meeting |
Publsiher | : The Electrochemical Society |
Total Pages | : 636 |
Release | : 2001 |
Genre | : Technology & Engineering |
ISBN | : 1566773083 |
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Handbook of Semiconductor Manufacturing Technology
Author | : Yoshio Nishi,Robert Doering |
Publsiher | : CRC Press |
Total Pages | : 1186 |
Release | : 2000-08-09 |
Genre | : Technology & Engineering |
ISBN | : 0824787838 |
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The Handbook of Semiconductor Manufacturing Technology describes the individual processes and manufacturing control, support, and infrastructure technologies of silicon-based integrated-circuit manufacturing, many of which are also applicable for building devices on other semiconductor substrates. Discussing ion implantation, rapid thermal processing, photomask fabrication, chip testing, and plasma etching, the editors explore current and anticipated equipment, devices, materials, and practices of silicon-based manufacturing. The book includes a foreword by Jack S. Kilby, cowinner of the Nobel Prize in Physics 2000 "for his part in the invention of the integrated circuit."
Proceedings of the Symposium on High Voltage and Smart Power ICs
Author | : Muhammed Ayman Shibib |
Publsiher | : Unknown |
Total Pages | : 558 |
Release | : 1989 |
Genre | : High voltages |
ISBN | : UCAL:$B85 |
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