Rf Mems Devices And Their Applications In Reconfigurable Rf Microwave Circuits

Microelectromechanical systems (MEMS) refer to a collection of micro-sensors and actuators, which can react to environmental change under micro- circuit control. The integration of MEMS into traditional Radio Frequency (RF) circuits has resulted in systems with superior performance levels and lower manufacturing costs. The incorporation of MEMS based fabrication technologies into micro and millimeter wave systems offers viable routes to ICs with MEMS actuators, antennas, switches and transmission lines. The resultant systems operate with an increased bandwidth and increased radiation efficiency and have considerable scope for implementation within the expanding area of wireless personal communication devices. This text provides leading edge coverage of this increasingly important area and highlights the overlapping information requirements of the RF and MEMS research and development communities. * Provides an introduction to micromachining techniques and their use in the fabrication of micro switches, capacitors and inductors * Includes coverage of MEMS devices for wireless and Bluetooth enabled systems Essential reading for RF Circuit design practitioners and researchers requiring an introduction to MEMS technologies, as well as practitioners and researchers in MEMS and silicon technology requiring an introduction to RF circuit design.

This is the first comprehensive book to address the design of RF MEMS-based circuits for use in high performance wireless systems. A groundbreaking research and reference tool, the book enables you to understand the realm of applications of RF MEMS technology; become knowledgeable of the wide variety and performance levels of RF MEMS devices; and partition the architecture of wireless systems to achieve greater levels of performance. This innovative resource also guides you through the design process of RF MEMS-based circuits, and establishes a practical knowledge base for the design of high-yield RF MEMS-based circuits. The book features exercises and detailed case studies on working RF MEMS circuits that help you decide what approaches best fit your design constraints. This unified treatment of RF MEMS-based circuit technology opens up a new world of solutions for meeting the unique challenges of low power/portable wireless products.

No matter how you slice it, semiconductor devices power the communications revolution. Skeptical? Imagine for a moment that you could flip a switch and instantly remove all the integrated circuits from planet Earth. A moment’s reflection would convince you that there is not a single field of human endeavor that would not come to a grinding halt, be it commerce, agriculture, education, medicine, or entertainment. Life, as we have come to expect it, would simply cease to exist. Drawn from the comprehensive and well-reviewed Silicon Heterostructure Handbook, this volume covers SiGe circuit applications in the real world. Edited by John D. Cressler, with contributions from leading experts in the field, this book presents a broad overview of the merits of SiGe for emerging communications systems. Coverage spans new techniques for improved LNA design, RF to millimeter-wave IC design, SiGe MMICs, SiGe Millimeter-Wave ICs, and wireless building blocks using SiGe HBTs. The book provides a glimpse into the future, as envisioned by industry leaders.

This book presents and discusses alternatives to ordinary transmission lines for the design and implementation of advanced RF/microwave components in planar technology. This book is devoted to the analysis, study and applications of artificial transmission lines mostly implemented by means of a host line conveniently modified (e.g., with modulation of transverse dimensions, with etched patterns in the metallic layers, etc.) or with reactive loading, in order to achieve novel device functionalities, superior performance, and/or reduced size. The author begins with an introductory chapter dedicated to the fundamentals of planar transmission lines. Chapter 2 is focused on artificial transmission lines based on periodic structures (including non-uniform transmission lines and reactively-loaded lines), and provides a comprehensive analysis of the coupled mode theory. Chapters 3 and 4 are dedicated to artificial transmission lines inspired by metamaterials, or based on metamaterial concepts. These chapters include the main practical implementations of such lines and their circuit models, and a wide overview of their RF/microwave applications (including passive and active circuits and antennas). Chapter 5 focuses on reconfigurable devices based on tunable artificial lines, and on non-linear transmission lines. The chapter also introduces several materials and components to achieve tuning, including diode varactors, RF-MEMS, ferroelectrics, and liquid crystals. Finally, Chapter 6 covers other advanced transmission lines and wave guiding structures, such as electroinductive-/magnetoinductive-wave lines, common-mode suppressed balanced lines, lattice-network artificial lines, and substrate integrated waveguides. Artificial Transmission Lines for RF and Microwave Applications provides an in-depth analysis and discussion of artificial transmission lines, including design guidelines that can be useful to researchers, engineers and students.

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.

An extraordinary combination of material science, manufacturing processes, and innovative thinking spurred the development of SiGe heterojunction devices that offer a wide array of functions, unprecedented levels of performance, and low manufacturing costs. While there are many books on specific aspects of Si heterostructures, the Silicon Heterostructure Handbook: Materials, Fabrication, Devices, Circuits, and Applications of SiGe and Si Strained-Layer Epitaxy is the first book to bring all aspects together in a single source. Featuring broad, comprehensive, and in-depth discussion, this handbook distills the current state of the field in areas ranging from materials to fabrication, devices, CAD, circuits, and applications. The editor includes "snapshots" of the industrial state-of-the-art for devices and circuits, presenting a novel perspective for comparing the present status with future directions in the field. With each chapter contributed by expert authors from leading industrial and research institutions worldwide, the book is unequalled not only in breadth of scope, but also in depth of coverage, timeliness of results, and authority of references. It also includes a foreword by Dr. Bernard S. Meyerson, a pioneer in SiGe technology. Containing nearly 1000 figures along with valuable appendices, the Silicon Heterostructure Handbook authoritatively surveys materials, fabrication, device physics, transistor optimization, optoelectronics components, measurement, compact modeling, circuit design, and device simulation.

This book describes a full range of contemporary techniques for the design of transmitters and receivers for communications systems operating in the range from 1 through to 300 GHz. In this frequency range there is a wide range of technologies that need to be employed, with silicon ICs at the core but, compared with other electronics systems, a much greater use of more specialist devices and components for high performance – for example, high Q-factor/low loss and good power efficiency. Many text books do, of course, cover these topics but what makes this book timely is the rapid adoption of millimetre-waves (frequencies from 30 to 300 GHz) for a wide range of consumer applications such as wireless high definition TV, '5G' Gigabit mobile internet systems and automotive radars. It has taken many years to develop low-cost technologies for suitable transmitters and receivers, so previously these frequencies have been employed only in expensive military and space applications. The book will cover these modern technologies, with the follow topics covered; transmitters and receivers, lumped element filters, tranmission lines and S-parameters, RF MEMS, RFICs and MMICs, and many others. In addition, the book includes extensive line diagrams to illustrate circuit diagrams and block diagrams of systems, including diagrams and photographs showing how circuits are implemented practically. Furthermore, case studies are also included to explain the salient features of a range of important wireless communications systems. The book is accompanied with suitable design examples and exercises based on the Advanced Design System – the industry leading CAD tool for wireless design. More importantly, the authors have been working with Keysight Technologies on a learning & teaching initiative which is designed to promote access to industry-standard EDA tools such as ADS. Through its University Educational Support Program, Keysight offers students the opportunity to request a student license, backed up with extensive classroom materials and support resources. This culminates with students having the chance to demonstrate their RF/MW design and measurement expertise through the Keysight RF & Microwave Industry-Ready Student Certification Program. www.keysight.com/find/eesof-university www.keysight.com/find/eesof-student-certification