Semiconductor Strain Metrology

This book surveys the major and newly developed techniques for semiconductor strain metrology. Semiconductor strain metrology has emerged in recent years as a topic of great interest to researchers involved in thin film and nanoscale device characterizati

The scales involved in modern semiconductor manufacturing and microelectronics continue to plunge downward. Effective and accurate characterization of materials with thicknesses below a few nanometers can be achieved using x-rays. While many books are available on the theory behind x-ray metrology (XRM), X-Ray Metrology in Semiconductor Manufacturing is the first book to focus on the practical aspects of the technology and its application in device fabrication and solving new materials problems. Following a general overview of the field, the first section of the book is organized by application and outlines the techniques that are best suited to each. The next section delves into the techniques and theory behind the applications, such as specular x-ray reflectivity, diffraction imaging, and defect mapping. Finally, the third section provides technological details of each technique, answering questions commonly encountered in practice. The authors supply real examples from the semiconductor and magnetic recording industries as well as more than 150 clearly drawn figures to illustrate the discussion. They also summarize the principles and key information about each method with inset boxes found throughout the text. Written by world leaders in the field, X-Ray Metrology in Semiconductor Manufacturing provides real solutions with a focus on accuracy, repeatability, and throughput.

Containing more than 300 equations and nearly 500 drawings, photographs, and micrographs, this reference surveys key areas such as optical measurements and in-line calibration methods. It describes cleanroom-based measurement technology used during the manufacture of silicon integrated circuits and covers model-based, critical dimension, overlay

This highly detailed handbook is a resource for those entering the field of stress analysis and instrumentation. The authors were brought together to provide their expert experience and have presented many practical solutions.

Traceable calibration of test and measurement equipment is a requirement of the ISO 9000 series of standards. Basic Metrology for ISO 9000 Certification provides essential information for the growing number of firms registered for ISO 9000. Dr. G.M.S. de Silva who has a lifetime of experience in metrology and quality management fields condenses that knowledge in this valuable and practical workbook. The book provides a basic understanding of the principles of measurement and calibration of measuring instruments falling into the following fields; Length,Angle, Mass, Pressure, Force, Temperature and AC/DC Electrical quantities. Basic concepts and definitions, ISO 9001 requirements and uncertainty determinations are also included.

This book has been written with total focus on meeting the objectives of the subject 'Electrical Measurement and Control' as given by the syllabus of WBSCTE. The text has been written so as to create interest in the minds of students in learning further. After reading this book the student will be able to: • Identify the sub-systems of a complete instrumentation system and explain the function of each • Select the correct transducer for receiving the measurement system input • Explain the basic signal conditioning processes, data transmission techniques, data storage and display devices • Understand the working of control devices used in motor controls and process controls • Represent a control system in a simplified block diagram form using transfer function • Determine the stability conditions of a system using stability study criteria and explain the use of different types of controllers