Semiconductor Wafer Bonding 11 Science Technology And Applications In Honor Of Ulrich G Sele
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Semiconductor Wafer Bonding 11 Science Technology and Applications In Honor of Ulrich G sele
Author | : C. Colinge |
Publsiher | : The Electrochemical Society |
Total Pages | : 656 |
Release | : 2010-10 |
Genre | : Science |
ISBN | : 9781566778237 |
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Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such diverse areas as high quality silicon-on-insulator (SOI) materials for electronic applications, Si-Ge strained layers, Germanium-on-Insulator (GeOI), 3D device integration, Si on quartz or glass for thin film displays, compound semiconductor-on-Si heterostructures and Micro-Electro-Mechanical Systems.
Semiconductor Wafer Bonding Science Technology and Applications V
Author | : Charles E. Hunt |
Publsiher | : The Electrochemical Society |
Total Pages | : 496 |
Release | : 2001 |
Genre | : Technology & Engineering |
ISBN | : 1566772583 |
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Semiconductor Water Bonding 11
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Author | : Anonim |
Publsiher | : Unknown |
Total Pages | : 640 |
Release | : 2010 |
Genre | : Electronic Book |
ISBN | : 1607681730 |
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Semiconductor Wafer Bonding Science Technology and Applications V
Author | : Charles E. Hunt |
Publsiher | : The Electrochemical Society |
Total Pages | : 498 |
Release | : 2001 |
Genre | : Technology & Engineering |
ISBN | : 1566772583 |
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Semiconductor Wafer Bonding VIII Science Technology and Applications
Author | : Anonim |
Publsiher | : The Electrochemical Society |
Total Pages | : 476 |
Release | : 2005 |
Genre | : Microelectromechanical systems |
ISBN | : 1566774608 |
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Semiconductor Wafer Bonding VII Science Technology and Applications
Author | : Anonim |
Publsiher | : The Electrochemical Society |
Total Pages | : 404 |
Release | : 2003 |
Genre | : Technology & Engineering |
ISBN | : 1566774020 |
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Semiconductor Wafer Bonding 9 Science Technology and Applications
Author | : Helmut Baumgart |
Publsiher | : The Electrochemical Society |
Total Pages | : 398 |
Release | : 2006 |
Genre | : Microelectromechanical systems |
ISBN | : 9781566775069 |
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This issue of ECS Transactions covers state-of-the-art R&D results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding Technology can be used to create novel composite materials systems and devices what would otherwise be unattainable. Wafer bonding today is rapidly expanding applications in such diverse fields as photonics, sensors, MEMS, X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI), and Nanotechnologies.
Proceedings of the International Symposium on Semiconductor Wafer Bonding
Author | : Anonim |
Publsiher | : Unknown |
Total Pages | : 524 |
Release | : 1991 |
Genre | : Semiconductor wafers |
ISBN | : UOM:39015038577287 |
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