Semiconductor Wafer Bonding 9 Science Technology And Applications
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Semiconductor Wafer Bonding 9 Science Technology and Applications
Author | : Helmut Baumgart |
Publsiher | : The Electrochemical Society |
Total Pages | : 398 |
Release | : 2006 |
Genre | : Microelectromechanical systems |
ISBN | : 9781566775069 |
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This issue of ECS Transactions covers state-of-the-art R&D results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding Technology can be used to create novel composite materials systems and devices what would otherwise be unattainable. Wafer bonding today is rapidly expanding applications in such diverse fields as photonics, sensors, MEMS, X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI), and Nanotechnologies.
Semiconductor Wafer Bonding Science Technology and Applications V
Author | : Charles E. Hunt |
Publsiher | : The Electrochemical Society |
Total Pages | : 496 |
Release | : 2001 |
Genre | : Technology & Engineering |
ISBN | : 1566772583 |
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Semiconductor Wafer Bonding Science Technology and Applications V
Author | : Charles E. Hunt |
Publsiher | : The Electrochemical Society |
Total Pages | : 498 |
Release | : 2001 |
Genre | : Technology & Engineering |
ISBN | : 1566772583 |
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Semiconductor Wafer Bonding 10 Science Technology and Applications
Author | : Anonim |
Publsiher | : The Electrochemical Society |
Total Pages | : 588 |
Release | : 2008-10 |
Genre | : Microelectromechanical systems |
ISBN | : 9781566776547 |
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This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafer bonding technology. Wafer Bonding is an Enabling Technology that can be used to create novel composite materials systems and devices that would otherwise be unattainable. Wafer Bonding today is rapidly expanding into new applications in such diverse fields as photonics, sensors, MEMS. X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI) and Nanotechnologies.
Semiconductor Wafer Bonding VIII Science Technology and Applications
Author | : Anonim |
Publsiher | : The Electrochemical Society |
Total Pages | : 476 |
Release | : 2005 |
Genre | : Microelectromechanical systems |
ISBN | : 1566774608 |
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Semiconductor Wafer Bonding VII Science Technology and Applications
Author | : Anonim |
Publsiher | : The Electrochemical Society |
Total Pages | : 404 |
Release | : 2003 |
Genre | : Technology & Engineering |
ISBN | : 1566774020 |
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Semiconductor Wafer Bonding
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Author | : R. Knechtel |
Publsiher | : Unknown |
Total Pages | : 225 |
Release | : 2020 |
Genre | : Electronic Book |
ISBN | : 1713819368 |
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Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding
Author | : U. Gösele |
Publsiher | : The Electrochemical Society |
Total Pages | : 636 |
Release | : 1998 |
Genre | : Technology & Engineering |
ISBN | : 1566771897 |
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