Si Rf Technology

This book discusses the recent research developments of various passive microwave circuits on silicon substrate and demonstrated operations catering for multiple frequency bands. It covers the design, modelling, process fabrication and characterization aspects with practical examples. The book will be of use to researchers and engineers working in the field of RF or microwave engineering, who can use the techniques and approaches effectively without having to refer to multiple sources.

This book discusses the recent research developments of various passive microwave circuits on silicon substrate and demonstrated operations catering for multiple frequency bands. It covers the design, modelling, process fabrication and characterization aspects with practical examples. The book will be of use to researchers and engineers working in the field of RF or microwave engineering, who can use the techniques and approaches effectively without having to refer to multiple sources.

A survey of microwave technology tailored for professionals in wireless communications RF Technologies for Low Power Wireless Communications updates recent developments in wireless communications from a hardware design standpoint and offers specialized coverage of microwave technology with a focus on the low power wireless units required in modern wireless systems. It explores results of recent research that focused on a holistic, integrated approach to the topics of materials, devices, circuits, modulation, and architectures rather than the more traditional approach of research into isolated topical areas. Twelve chapters deal with various fundamental research aspects of low power wireless electronics written by world-class experts in each field. The first chapter offers an overview of wireless architecture and performance, followed by detailed coverage of: Advanced GaAs-based HBT designs InP-based devices and circuits Si/SiGe HBT technology Noise in GaN devices Power amplifier architectures and nonlinearities Planar-oriented components MEMS and micromachined components Resonators, filters, and low-noise oscillators Antennas Transceiver front-end architectures With a clear focus and expert contributors, RF Technologies for Low Power Wireless Communications will be of interest to a wide range of electrical engineering disciplines working in wireless technologies.

Presents wideband RF technologies and antennas in the microwave band and millimeter-wave band This book provides an up-to-date introduction to the technologies, design, and test procedures of RF components and systems at microwave frequencies. The book begins with a review of the elementary electromagnetics and antenna topics needed for students and engineers with no basic background in electromagnetic and antenna theory. These introductory chapters will allow readers to study and understand the basic design principles and features of RF and communication systems for communications and medical applications. After this introduction, the author examines MIC, MMIC, MEMS, and LTCC technologies. The text will also present information on meta-materials, design of microwave and mm wave systems, along with a look at microwave and mm wave receivers, transmitters and antennas. Discusses printed antennas for wireless communication systems and wearable antennas for communications and medical applications Presents design considerations with both computed and measured results of RF communication modules and CAD tools Includes end-of-chapter problems and exercises Wideband RF Technologies and Antennas in Microwave Frequencies is designed to help electrical engineers and undergraduate students to understand basic communication and RF systems definition, electromagnetic and antennas theory and fundamentals with minimum integral and differential equations. Albert Sabban, PhD, is a Senior Researcher and Lecturer at Ort Braude College Karmiel Israel. Dr. Sabban was RF and antenna specialist at communication and Biomedical Hi-tech Companies. He designed wearable compact antennas to medical systems. From 1976 to 2007, Dr. Albert Sabban worked as a senior R&D scientist and project leader in RAFAEL.

TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods Offers a systematic and comparative literature review of HR-Si interposer technology by topic Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems Gives a systematic and accessible accounting on this leading technology

Radio-Frequency Integrated-Circuit Engineering addressesthe theory, analysis and design of passive and active RFIC's usingSi-based CMOS and Bi-CMOS technologies, and other non-silicon basedtechnologies. The materials covered are self-contained andpresented in such detail that allows readers with onlyundergraduate electrical engineering knowledge in EM, RF, andcircuits to understand and design RFICs. Organized into sixteenchapters, blending analog and microwave engineering,Radio-Frequency Integrated-Circuit Engineering emphasizesthe microwave engineering approach for RFICs. • Provides essential knowledge in EM and microwaveengineering, passive and active RFICs, RFIC analysis and designtechniques, and RF systems vital for RFIC students andengineers • Blends analog and microwave engineering approaches forRFIC design at high frequencies • Includes problems at the end of each chapter

New Materials and Devices for 5G Applications and Beyond focuses on the materials, device architectures and enabling integration schemes for 5G applications and emerging technologies. It gives a comprehensive overview of the trade-offs, challenges and unique properties of novel upcoming technologies. Starting from the application side and its requirements, the book examines different technologies under consideration for the different functions, both more conventional to exploratory, and within this context the book provides guidance to the reader on how to possibly optimize the system for a particular application. This book aims at guiding the reader through the technologies required to enable 5G applications, with the main focus on mm-wave frequencies, up to THz. New Materials and Devises for 5G Applications and Beyond is suitable for industrial researchers and development engineers, and researchers in materials science, device engineering and circuit design. Reviews challenges and emerging opportunities for materials, devices, and integration to enable 5G technologies Includes discussion of technologies such as RF-MEMs, RF FINFETs, and transistors based on current and emerging materials (InP, GaN, etc.) Focuses on mm-wave frequencies up to the terahertz regime

This timely new resource presents an overview of the electronics of mobile network backhaul. Infrastructure planning, architecture evolution, digital controls, and countermeasures are all presented highlighting the building blocks of specific backhaul features. Tx and Rx design and antenna requirements and covered while examining the overall construction of the microwave radio hardware blocks. Single blocks are explored: the antenna, the analog transmitter and receiver, and the modem, recalling the most important aspects of transport networks and microwave link dimensioning. Essential theory is provided for each hardware block with an emphasis on present solutions. Authored by academic and industrial experts in the field, development and design engineers will benefit from the practical guidance in solving realistic issues and providing useful tips throughout the design process. This book guides readers through the historical evolution of microwave radios and the components of the next generation of mobile networks.