Silicon Photonic Modulators For Low Power Applications

In this book, silicon photonic integrated circuits are combined with electro-optic organic materials for realizing energy-efficient modulators with unprecedented performance. These silicon-organic hybrid Mach-Zehnder modulators feature a compact size, sub-Volt drive voltages, and they support data rates up to 84 Gbit/s. In addition, a wet chemical waveguide fabrication scheme and an efficient fiber-chip coupling scheme are presented. This work was published by Saint Philip Street Press pursuant to a Creative Commons license permitting commercial use. All rights not granted by the work's license are retained by the author or authors.

In this book, the first high-speed silicon-organic hybrid (SOH) modulator is demonstrated by exploiting a highly-nonlinear polymer cladding and a silicon waveguide. By using a liquid crystal cladding instead, an ultra-low power phase shifter is obtained. A third type of device is proposed for achieving three-wave mixing on the silicon-organic hybrid (SOH) platform. Finally, new physical constants which describe the optical absorption in charge accumulation/inversion layers in silicon are determined.

This book is volume III of a series of books on silicon photonics. It reports on the development of fully integrated systems where many different photonics component are integrated together to build complex circuits. This is the demonstration of the fully potentiality of silicon photonics. It contains a number of chapters written by engineers and scientists of the main companies, research centers and universities active in the field. It can be of use for all those persons interested to know the potentialities and the recent applications of silicon photonics both in microelectronics, telecommunication and consumer electronics market.

"This book discusses the principles and the latest progress of silicon optical modulators as cutting-edge integrated photonic devices on silicon-photonic platforms, which play key roles in modern optical communications with low power consumption, small footprints, and low manufacturing costs. Silicon Mach-Zehnder optical modulators are emphasized as the principal small-footprint optical modulator because of its superior performance in high-speed optical modulation at operational temperatures beyond 100 degrees Celsius without power-consuming thermo-electric cooling in spectral bands over 100 nm"--

Optical Interconnects in Future Data Center Networks covers optical networks and how they can be used to provide high bandwidth, energy efficient interconnects for future data centers with increased communication bandwidth requirements. This contributed volume presents an integrated view of the future requirements of the data centers and serves as a reference work for some of the most advanced solutions that have been proposed by major universities and companies. Collecting the most recent and innovative optical interconnects for data center networks that have been presented in the research community by universities and industries, this book is a valuable reference to researchers, students, professors and engineers interested in the domain of high performance interconnects and data center networks. Additionally, Optical Interconnects in Future Data Center Networks provides invaluable insights into the benefits and advantages of optical interconnects and how they can be a promising alternative for future data center networks.

Integrated Photonics for Data Communications Applications reviews the key concepts, design principles, performance metrics and manufacturing processes from advanced photonic devices to integrated photonic circuits. The book presents an overview of the trends and commercial needs of data communication in data centers and high-performance computing, with contributions from end users presenting key performance indicators. In addition, the fundamental building blocks are reviewed, along with the devices (lasers, modulators, photodetectors and passive devices) that are the individual elements that make up the photonic circuits. These chapters include an overview of device structure and design principles and their impact on performance. Following sections focus on putting these devices together to design and fabricate application-specific photonic integrated circuits to meet performance requirements, along with key areas and challenges critical to the commercial manufacturing of photonic integrated circuits and the supply chains being developed to support innovation and market integration are discussed. This series is led by Dr. Lionel Kimerling Executive at AIM Photonics Academy and Thomas Lord Professor of Materials Science and Engineering at MIT and Dr. Sajan Saini Education Director at AIM Photonics Academy at MIT. Each edited volume features thought-leaders from academia and industry in the four application area fronts (data communications, high-speed wireless, smart sensing, and imaging) and addresses the latest advances. Includes contributions from leading experts and end-users across academia and industry working on the most exciting research directions of integrated photonics for data communications applications Provides an overview of data communication-specific integrated photonics starting from fundamental building block devices to photonic integrated circuits to manufacturing tools and processes Presents key performance metrics, design principles, performance impact of manufacturing variations and operating conditions, as well as pivotal performance benchmarks