Thermal Management Of Electronic Systems Iii
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Thermal Management of Electronic Systems
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Author | : Cohen,Kraus |
Publsiher | : Academic Press |
Total Pages | : 650 |
Release | : 2000-02-28 |
Genre | : Electronic Book |
ISBN | : 0120781557 |
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Thermal Management of Electronic Systems III
Author | : J. P. Bardon,Éric Beyne,J. B. Saulnier |
Publsiher | : Elsevier Science Limited |
Total Pages | : 271 |
Release | : 1998 |
Genre | : Electronic apparatus and appliances |
ISBN | : 2842990331 |
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Thermal Management of Electronic Systems II
Author | : E. Beyne,C.J.M. Lasance,J. Berghmans |
Publsiher | : Springer Science & Business Media |
Total Pages | : 358 |
Release | : 2012-12-06 |
Genre | : Technology & Engineering |
ISBN | : 9789401155069 |
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For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.
Cooling of Electronic Systems
Author | : Sadik Kakaç,Hafit Yüncü,K. Hijikata |
Publsiher | : Springer Science & Business Media |
Total Pages | : 953 |
Release | : 2012-12-06 |
Genre | : Technology & Engineering |
ISBN | : 9789401110907 |
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Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Thermal Management of Electronic Systems
Author | : C.J. Hoogendoorn,R.A.W.M. Henkes,C.J.M. Lasance |
Publsiher | : Springer Science & Business Media |
Total Pages | : 334 |
Release | : 2012-12-06 |
Genre | : Technology & Engineering |
ISBN | : 9789401110822 |
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The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera tures of critical electronic parts with the required accuracy. He or she· had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion.
Heat Transfer
Author | : Younes Shabany |
Publsiher | : CRC Press |
Total Pages | : 526 |
Release | : 2009-12-17 |
Genre | : Science |
ISBN | : 9781439814680 |
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The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use
Advanced Materials for Thermal Management of Electronic Packaging
Author | : Xingcun Colin Tong |
Publsiher | : Springer Science & Business Media |
Total Pages | : 633 |
Release | : 2011-01-05 |
Genre | : Technology & Engineering |
ISBN | : 9781441977595 |
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The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Thermal Management Handbook For Electronic Assemblies
Author | : Jerry E. Sergent,Al Krum |
Publsiher | : McGraw Hill Professional |
Total Pages | : 370 |
Release | : 1998 |
Genre | : Science |
ISBN | : 0070266999 |
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Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.