Vlsi Fabrication Principles

In some places, the order of presentation has been changed to fine-tune the book's effectiveness as a senior and graduate-level teaching text. Fabrication principles covered include those for such circuits as CMOS, BIPOLAR, BICMOS, FET, and more.

Fully updated with the latest technologies, this edition covers thefundamental principles underlying fabrication processes forsemiconductor devices along with integrated circuits made fromsilicon and gallium arsenide. Stresses fabrication criteria forsuch circuits as CMOS, bipolar, MOS, FET, etc. These diversetechnologies are introduced separately and then consolidated intocomplete circuits. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment.

About The Book: Fully updated with the latest technologies, this edition covers the fundamental principles underlying fabrication processes for semiconductor devices along with integrated circuits made from silicon and gallium arsenide. Stresses fabrication criteria for such circuits as CMOS, bipolar, MOS, FET, etc. These diverse technologies are introduced separately and then consolidated into complete circuits.

The current cutting-edge VLSI circuit design technologies provide end-users with many applications, increased processing power and improved cost effectiveness. This trend is accelerating, with significant implications on future VLSI and systems design. VLSI design engineers are always in demand for front-end and back-end design applications.The book aims to give future and current VSLI design engineers a robust understanding of the underlying principles of the subject. It not only focuses on circuit design processes obeying VLSI rules but also on technological aspects of fabrication. The Hardware Description Language (HDL) Verilog is explained along with its modelling style. The book also covers CMOS design from the digital systems level to the circuit level. The book clearly explains fundamental principles and is a guide to good design practices.The book is intended as a reference book for senior undergraduate, first-year post graduate students, researchers as well as academicians in VLSI design, electronics & electrical engineering and materials science. The basics and applications of VLSI design from digital system design to IC fabrication and FPGA Prototyping are each covered in a comprehensive manner. At the end of each unit is a section with technical questions including solutions which will serve as an excellent teaching aid to all readers.Technical topics discussed in the book include: • Digital System Design• Design flow for IC fabrication and FPGA based prototyping • Verilog HDL• IC Fabrication Technology• CMOS VLSI Design• Miscellaneous (It covers basics of Electronics, and Reconfigurable computing, PLDs, Latest technology etc.).

The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.

A reprint of the classic text, this book popularized compact modeling of electronic and semiconductor devices and components for college and graduate-school classrooms, and manufacturing engineering, over a decade ago. The first comprehensive book on MOS transistor compact modeling, it was the most cited among similar books in the area and remains the most frequently cited today. The coverage is device-physics based and continues to be relevant to the latest advances in MOS transistor modeling. This is also the only book that discusses in detail how to measure device model parameters required for circuit simulations. The book deals with the MOS Field Effect Transistor (MOSFET) models that are derived from basic semiconductor theory. Various models are developed, ranging from simple to more sophisticated models that take into account new physical effects observed in submicron transistors used in today's (1993) MOS VLSI technology. The assumptions used to arrive at the models are emphasized so that the accuracy of the models in describing the device characteristics are clearly understood. Due to the importance of designing reliable circuits, device reliability models are also covered. Understanding these models is essential when designing circuits for state-of-the-art MOS ICs.

Aimed primarily for undergraduate students pursuing courses in VLSI design, the book emphasizes the physical understanding of underlying principles of the subject. It not only focuses on circuit design process obeying VLSI rules but also on technological aspects of Fabrication. VHDL modeling is discussed as the design engineer is expected to have good knowledge of it. Various Modeling issues of VLSI devices are focused which includes necessary device physics to the required level. With such an in-depth coverage and practical approach practising engineers can also use this as ready reference. Key features: Numerous practical examples. Questions with solutions that reflect the common doubts a beginner encounters. Device Fabrication Technology. Testing of CMOS device BiCMOS Technological issues. Industry trends. Emphasis on VHDL.