2016 12th International Congress Molded Interconnect Devices Mid

Annotation Due to a direct application of conductor tracks and functional structures on randomly shaped substrates, the technology MID (Molded Interconnect Devices Mechatronic Integrated Devices) enables the production of highly integrated mechatronic products. Since 1994, the Research Association 3 D MID biennially organizes the International Congress Molded Interconnect Devices in Germany in order to support the further development of the technology by offering a platform for the global transfer of knowledge and information. With about 300 participants from all over the world this international recognized conference is the worlds leading event in the field of MID Further information http://www.3dmid.de/technology.html.

This book reports on the design, fabrication and characterization of a set of flexible electronic components, including on-foil sensors, organic thin-film transistors and ultra-thin chips. The core of the work is on showing how to combine high-performance integrated circuits with large-area electronic components on a single polymeric foil, to realize smart electronic systems for different applications, such as temperature, humidity and mechanical stress sensors. The book offers an extensive introduction to Hybrid System-in-Foil technology (HySiF), and related on-chip/on-foil passive and active components. It presents six case studies designed to highlight key HySiF challenges, together with the methodology to address those challenges. Last but not least, it describes the development of a reconfigurable, energy-efficient Analog-to-Digital Converter for HySiF. All in all, this book provides readers with extensive information on the state of the art in the design and characterization of integrated circuits and hybrid electronic systems on flexible polymeric substrates. By describing significant advances in organic thin-film transistor technology, this work is expected to pave the way to future developments in the area of energy-efficient smart sensors and integrated circuits.

In this dissertation a new process chain for the Additive Manufacturing of Mechatronic Integrated Devices (AMMID) is described, which provides a new way to manufacture 3-dimensional electronic devices based on the selective laser sintering (SLS) process using laser direct structuring (LDS) and metallization. The AMMID process chain meets the rising demand for highly functionalized parts, increasing individualization and shortening development cycles for electronic products. The development for this process chain is based on an extensive literature review that indicates that an SLS-based process chain has great potential to produce 3-dimensional electronic devices with properties and with the future perspective of being suitable for an individualized mass production. The biggest, initial, technical hurdle is an unstable SLS process using a conventional LDS additive. The compound of SLS material and LDS additive was analyzed with DSC, which shows that the additive changes the melting behavior of the polymer by reducing the sintering window. A fine metal powder as an alternative additive affects the sintering window less and enables a stable process. To choose a suitable particle size and content for the metal powder an analytical material model is provided, that predicts the additive particle distribution within the material. This material model deepens the understanding of the activation mechanism during laser activation, provides hands-on information for powder preparation and it is applied for the design of the experiment for the development of the process chain with the new material. Preliminary experiments are conducted along with the insights of the material model, which prove that redeposition is the main activation mechanism during laser activation with fine metal powders. Based on this, the process chain is developed, starting with a determination of a suitable additive content. A suitable material composition of a PA12 powder containing 2 wt.% of a copper powder with a mean particle diameter of 3.5 μm was identified. With regard to the laser activation, working laser parameters are developed (working parameter set feasible for all used post-process treatments: PRF = 1 kHz, dh = 25 μm, vs = 25 mm/s, tl = 20ns and P = 1.07 W). In this parameter development it is shown, that only closely located laser spots, enabling interaction of the laser pulses, are capable of activating the surface, while single laser pulses under applied conditions are not. By adding a post-process treatment as additional process step into the process chain, the quality of metallization and the size of design features could be improved. Chemical smoothing resulted in a complete reduction of unwanted metallization on non-activated surfaces. Conductor tracks with the minimal width of 300 μm could be realized. The process chain could be applied to demonstrator parts such as a drone housing and a PSU panel of an aircraft. Thus, this dissertation has raised the technology readiness level (TRL) from TRL2 to TRL6. Finally, an economic consideration provides insights on the cost structure of parts produced with the AMMID process. A comparison of AMMID and injection molding shows economic viability for small lot sizes, 400 parts in case of the drone housing and 150 parts in case of the PSU panel. Finally, the analysis of the cost structure gives advice which future developments in the process chain have the greatest effect on costs and provides prioritization.

Advances in Manufacturing and Processing of Materials and Structures cover the latest advances in materials and structures in manufacturing and processing including additive and subtractive processes. It's intended to provide a compiled resource that reviews details of the advances that have been made in recent years in manufacturing and processing of materials and structures. A key development incorporated within this book is 3D printing, which is being used to produce complex parts including composites with odd shape fibers, as well as tissue and body organs. This book has been tailored for engineers, scientists and practitioners in different fields such as aerospace, mechanical engineering, materials science and biomedicine. Biomimetic principles have also been integrated. Features Provides the latest state-of-the art on different manufacturing processes, including a biomimetics viewpoint Offers broad coverage of advances in materials and manufacturing Written by chapter authors who are world-class researchers in their respective fields Provides in-depth presentation of the latest 3D and 4D technologies related to various manufacturing disciplines Provides substantial references in each chapter to enhance further study

The papers in this volume present recent and highly relevant topics in the fields of production research as 3D printing, additive manufacturing processes, agile product development, change dynamics in companies, configurable material systems, data analysis in process optimization, future technologies with high potential in value creation, global production, learning production systems, production of the future, organization of assemblies, resource efficiency in production, robotics in assembly, and technology trends in machine tools. Researchers and practitioners in the field of mechanical engineering and production technology will benefit from this content.

This book reports on cutting-edge design methods and tools in industrial engineering, advanced findings in mechanics and material science, and relevant technological applications. Topics span from geometric modelling tools to applications of virtual/augmented reality, from interactive design to ergonomics, human factors research and reverse engineering. Further topics include integrated design and optimization methods, as well as experimental validation techniques for product, processes and systems development, such as additive manufacturing technologies. This book is based on the International Conference on Design Tools and Methods in Industrial Engineering, ADM 2019, held on September 9–10, 2019, in Modena, Italy, and organized by the Italian Association of Design Methods and Tools for Industrial Engineering, and the Department of Engineering “Enzo Ferrari” of the University of Modena and Reggio Emilia, Italy. It provides academics and professionals with a timely overview and extensive information on trends and technologies in industrial design and manufacturing.

Light signals in optical waveguides can be used to transmit very large amounts of data quickly and largely without interference. In the industrial and infrastructural sectors, e.g. in the automotive and aerospace industries, the demand to further exploit this potential is therefore increasing. Which technologies can be used to effectively integrate systems that transmit data by means of light into existing components? This is a central question for current research. So far, there have been some technical limitations in this regard. For example, it is difficult to couple the signal of an optical waveguide to other optical waveguides without interruption. There is also a lack of suitable fabrication technologies for three-dimensional waveguides, as well as design and simulation environments for 3D opto-MID. This book addresses these and other challenges.