3d Ic And Rf Sips Advanced Stacking And Planar Solutions For 5g Mobility

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools

This is the third revised edition of the established and trusted RFID Handbook; the most comprehensive introduction to radio frequency identification (RFID) available. This essential new edition contains information on electronic product code (EPC) and the EPC global network, and explains near-field communication (NFC) in depth. It includes revisions on chapters devoted to the physical principles of RFID systems and microprocessors, and supplies up-to-date details on relevant standards and regulations. Taking into account critical modern concerns, this handbook provides the latest information on: the use of RFID in ticketing and electronic passports; the security of RFID systems, explaining attacks on RFID systems and other security matters, such as transponder emulation and cloning, defence using cryptographic methods, and electronic article surveillance; frequency ranges and radio licensing regulations. The text explores schematic circuits of simple transponders and readers, and includes new material on active and passive transponders, ISO/IEC 18000 family, ISO/IEC 15691 and 15692. It also describes the technical limits of RFID systems. A unique resource offering a complete overview of the large and varied world of RFID, Klaus Finkenzeller’s volume is useful for end-users of the technology as well as practitioners in auto ID and IT designers of RFID products. Computer and electronics engineers in security system development, microchip designers, and materials handling specialists benefit from this book, as do automation, industrial and transport engineers. Clear and thorough explanations also make this an excellent introduction to the topic for graduate level students in electronics and industrial engineering design. Klaus Finkenzeller was awarded the Fraunhofer-Smart Card Prize 2008 for the second edition of this publication, which was celebrated for being an outstanding contribution to the smart card field.

A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

This book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics and telecommunication. It includes original research presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2019), organized by the Department of ECE, Raghu Institute of Technology, Andhra Pradesh, India. Written by scientists, research scholars and practitioners from leading universities, engineering colleges and R&D institutes around the globe, the papers share the latest breakthroughs in and promising solutions to the most important issues facing today’s society.

In recent years, transmitarray antennas have attracted growing interest with many antenna researchers. Transmitarrays combines both optical and antenna array theory, leading to a low profile design with high gain, high radiation efficiency, and versatile radiation performance for many wireless communication systems. In this book, comprehensive analysis, new methodologies, and novel designs of transmitarray antennas are presented. Detailed analysis for the design of planar space-fed array antennas is presented. The basics of aperture field distribution and the analysis of the array elements are described. The radiation performances (directivity and gain) are discussed using array theory approach, and the impacts of element phase errors are demonstrated. The performance of transmitarray design using multilayer frequency selective surfaces (M-FSS) approach is carefully studied, and the transmission phase limit which are generally independent from the selection of a specific element shape is revealed. The maximum transmission phase range is determined based on the number of layers, substrate permittivity, and the separations between layers. In order to reduce the transmitarray design complexity and cost, three different methods have been investigated. As a result, one design is performed using quad-layer cross-slot elements with no dielectric material and another using triple-layer spiral dipole elements. Both designs were fabricated and tested at X-Band for deep space communications. Furthermore, the radiation pattern characteristics were studied under different feed polarization conditions and oblique angles of incident field from the feed. New design methodologies are proposed to improve the bandwidth of transmitarray antennas through the control of the transmission phase range of the elements. These design techniques are validated through the fabrication and testing of two quad-layer transmitarray antennas at Ku-band. A single-feed quad-beam transmitarray antenna with 50 degrees elevation separation between the beams is investigated, designed, fabricated, and tested at Ku-band. In summary, various challenges in the analysis and design of transmitarray antennas are addressed in this book. New methodologies to improve the bandwidth of transmitarray antennas have been demonstrated. Several prototypes have been fabricated and tested, demonstrating the desirable features and potential new applications of transmitarray antennas.