Bonding

This review has been written as a practical approach to bonding various kinds of elastomers to substrates such as steel and plastics, as used in the manufacture of diverse products such as rubber covered rolls, urethane fork lift wheels, rubber lining for chemical storage or solid rocket motors, engine bushes and mounts, seals for transmissions, electrical power connectors and military tank track pads. Based on the authors' years of experience working closely with end-use customers and it offers a thorough overview of how to successfully bond rubber to a given substrate in the manufacture of quality rubber engineered components. This review is supported by an indexed section containing several hundred key references and abstracts selected from the Rapra Abstracts database.

This issue of ECS Transactions covers state-of-the-art R&D results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding Technology can be used to create novel composite materials systems and devices what would otherwise be unattainable. Wafer bonding today is rapidly expanding applications in such diverse fields as photonics, sensors, MEMS, X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI), and Nanotechnologies.

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.