Chips Pop
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Chips 2020
Author | : Bernd Hoefflinger |
Publsiher | : Springer Science & Business Media |
Total Pages | : 497 |
Release | : 2012-01-19 |
Genre | : Science |
ISBN | : 9783642223990 |
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The chips in present-day cell phones already contain billions of sub-100-nanometer transistors. By 2020, however, we will see systems-on-chips with trillions of 10-nanometer transistors. But this will be the end of the miniaturization, because yet smaller transistors, containing just a few control atoms, are subject to statistical fluctuations and thus no longer useful. We also need to worry about a potential energy crisis, because in less than five years from now, with current chip technology, the internet alone would consume the total global electrical power! This book presents a new, sustainable roadmap towards ultra-low-energy (femto-Joule), high-performance electronics. The focus is on the energy-efficiency of the various chip functions: sensing, processing, and communication, in a top-down spirit involving new architectures such as silicon brains, ultra-low-voltage circuits, energy harvesting, and 3D silicon technologies. Recognized world leaders from industry and from the research community share their views of this nanoelectronics future. They discuss, among other things, ubiquitous communication based on mobile companions, health and care supported by autonomous implants and by personal carebots, safe and efficient mobility assisted by co-pilots equipped with intelligent micro-electromechanical systems, and internet-based education for a billion people from kindergarden to retirement. This book should help and interest all those who will have to make decisions associated with future electronics: students, graduates, educators, and researchers, as well as managers, investors, and policy makers. Introduction: Towards Sustainable 2020 Nanoelectronics.- From Microelectronics to Nanoelectronics.- The Future of Eight Chip Technologies.- Analog–Digital Interfaces.- Interconnects and Transceivers.- Requirements and Markets for Nanoelectronics.- ITRS: The International Technology Roadmap for Semiconductors.- Nanolithography.- Power-Efficient Design Challenges.- Superprocessors and Supercomputers.- Towards Terabit Memories.- 3D Integration for Wireless Multimedia.- The Next-Generation Mobile User-Experience.- MEMS (Micro-Electro-Mechanical Systems) for Automotive and Consumer.- Vision Sensors and Cameras.- Digital Neural Networks for New Media.- Retinal Implants for Blind Patients.- Silicon Brains.- Energy Harvesting and Chip Autonomy.- The Energy Crisis.- The Extreme-Technology Industry.- Education and Research for the Age of Nanoelectronics.- 2020 World with Chips.
Wafer Level Chip Scale Packaging
Author | : Shichun Qu,Yong Liu |
Publsiher | : Springer |
Total Pages | : 322 |
Release | : 2014-09-10 |
Genre | : Technology & Engineering |
ISBN | : 9781493915569 |
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Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.
Nadiya Bakes
Author | : Nadiya Hussain |
Publsiher | : Penguin UK |
Total Pages | : 256 |
Release | : 2020-09-03 |
Genre | : Cooking |
ISBN | : 9780241396629 |
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'The cookbook we all need this year' WOMAN & HOME 'Showstoppers and classic baking for every occasion' SUNDAY TIMES 'Delicious' Times 'Let Nadiya fill your kitchen with pure joy' Woman & Home ___________ Our beloved Bake-Off winner has created your ultimate baking cookbook to help you conquer cakes, biscuits, traybakes, tarts and pies, showstopping desserts, breads, savoury bakes, and even 'no-bake' bakes - all with her signature mouth-watering twists. Some of Nadiya's deliciously easy recipes you can achieve at home include: · Blueberry and Lavender Scone Pizza · Mango and Coconut Cake · Sharing Chocolate Fondant · 'Money Can't Buy You Happiness' Brownies · Potato Rosti Quiche · Pepperoni Pull Apart Bread . . . and much, much more From classic baking staples to dazzling show-stoppers, you'll discover new favourite recipes for every day and every celebration - it's time to shake up your bakes! ___________ * Pre order Nadiya's new cookbook, Nadiya's Fast Flavours now, for exciting meals guaranteed to get your taste buds going every night of the week *
Microwave and Millimeter Wave Chips Based on Thin Film Integrated Passive Device Technology
Author | : Yongle Wu,Weimin Wang |
Publsiher | : Springer Nature |
Total Pages | : 323 |
Release | : 2023-06-01 |
Genre | : Technology & Engineering |
ISBN | : 9789819914555 |
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This book adopts the latest academic achievements of microwave and millimeter-wave chips based on thin-film integrated passive device technology as specific cases. Coherent processes of basic theories and design implementations of microwave and millimeter-wave chips are presented in detail. It forms a complete system from design theory, circuit simulation, full-wave electromagnetic simulation, and fabrication to measurement. Five representative microwave and millimeter-wave passive chips based on TFIPD technology are taken as examples to demonstrate the complete process from theory, design, simulation, fabrication, and measurement, which is comprehensive, systematical, and easy to learn and understand, convenient to operate, and close to the practical application. This book is mainly aimed at the design and simulation of microwave and millimeter-wave chips based on thin-film integrated passive device technology. On the basis of specific cases, it introduces the whole process from theory, design, simulation, optimization, fabrication to measurement of the balanced filter, microstrip filter, absorptive filter, power divider, and balun. This book is suitable for the professional technicians who are engaged in the design and engineering application of microwave and millimeter-wave device chips. It can also be used as the textbook of electronic science and technology, electromagnetic field and microwave technology, electronic engineering, radar engineering, integrated circuit, and other related majors in colleges and universities.
Chips Pop
Author | : Robert Barnard,Dave Cosgrave,Jennifer M. Welsh |
Publsiher | : Unknown |
Total Pages | : 304 |
Release | : 1998 |
Genre | : Generation X |
ISBN | : PSU:000033788128 |
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"By definition, this generation -- those born between the early sixties and late seventies -- has no "hard edges". It is a generation based on formative experiences and pivotal events rather than specific birthdates and cohort size. Essentially, you are a Nexus if you first felt the effects of the computer chip and global media at some point during your formative years. This means you could have encountered a PC for the first time in university or mastered Pong (the first video game) at the age of seven. You could be Nexus if you watched live CNN coverage of the Gulf War at high school, saw the space shuttle Challenger blow up in high school, or were the first kid in your neighbourhood with cable TV and a remote control." (p.17,18).
Ancient Aliens the Healing of Billie Save Planet Earth
Author | : William Stanley Henderson Jr. |
Publsiher | : Fulton Books, Inc. |
Total Pages | : 728 |
Release | : 2016-05-23 |
Genre | : Fiction |
ISBN | : 9781633382619 |
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By writing the book of the "Ancient Alien Angels the Healing of Billie", I am releasing my anger at society and religion and mostly my parents for the abuse that I had placed upon me by their actions thoughts. Then through forgiveness I set myself free of the past and releasing them from me so that they no longer have a hold or say or power in my life. I have taken back my power from them and they no longer can make me feel like a victim a helpless child that I no longer view myself as a victim in life. My book is an in depth look into my life from birth to now 65 years later every event in my life I have seen and from the eyes of the child within through my teen age years into adult hood from anger and hate to love and peace within. I had locked away the inner child not wanting to face my past and as society religion and my parents had made me feel like a bad person and I did not want to show the world around me my dark past and I locked Billie in a cage and hid him from myself and the world and now Billie is free and so am I.
10th European Conference on Games Based Learning
Author | : Anonim |
Publsiher | : Academic Conferences and publishing limited |
Total Pages | : 135 |
Release | : 2024 |
Genre | : Electronic Book |
ISBN | : 9781911218098 |
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101 Math Activities for Calculating Kids
Author | : Tracey Ann Schofield |
Publsiher | : Lorenz Educational Press |
Total Pages | : 116 |
Release | : 2001-03-01 |
Genre | : Juvenile Nonfiction |
ISBN | : 9781573102698 |
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Explore math concepts, explore "real-world" situations, encourage logical thinking, motivate your students.