Counterfeit Integrated Circuits

This timely and exhaustive study offers a much-needed examination of the scope and consequences of the electronic counterfeit trade. The authors describe a variety of shortcomings and vulnerabilities in the electronic component supply chain, which can result in counterfeit integrated circuits (ICs). Not only does this book provide an assessment of the current counterfeiting problems facing both the public and private sectors, it also offers practical, real-world solutions for combatting this substantial threat. · Helps beginners and practitioners in the field by providing a comprehensive background on the counterfeiting problem; · Presents innovative taxonomies for counterfeit types, test methods, and counterfeit defects, which allows for a detailed analysis of counterfeiting and its mitigation; · Provides step-by-step solutions for detecting different types of counterfeit ICs; · Offers pragmatic and practice-oriented, realistic solutions to counterfeit IC detection and avoidance, for industry and government.

This book describes techniques to verify the authenticity of integrated circuits (ICs). It focuses on hardware Trojan detection and prevention and counterfeit detection and prevention. The authors discuss a variety of detection schemes and design methodologies for improving Trojan detection techniques, as well as various attempts at developing hardware Trojans in IP cores and ICs. While describing existing Trojan detection methods, the authors also analyze their effectiveness in disclosing various types of Trojans, and demonstrate several architecture-level solutions.

Why should the supply chain be concerned if their buyers or subcontractors are purchasing counterfeit electronic parts or if their products contain counterfeit electronic parts? If these parts end up in items that are safety critical and security-risk sensitive such as aviation, space, and defense products, whole secure systems can be comprised. As organizations have become aware of counterfeit parts, one of their responses may be to test upon acceptance or prior to receipt. But testing alone may not detect all counterfeits. Possible sources of counterfeits include products that did not meet quality control requirements and were not destroyed, overruns sold into the market place, unauthorized production shifts, theft, and e-waste. The counterfeited electronic part ends up in the supply chain when ordered by an unsuspecting buyer, who does not confirm the originating source of the part. The second edition of Counterfeit Parts and Their Impact on the Supply Chain expands on the latest insights of what is really happening in the world of supply chains, quality monitoring and testing, counterfeiting mitigation and avoidance strategy. It brings new light into the consequences of weak supply-chain monitoring and how costs, reliability and reputation are negatively impacted by counterfeit products and components.

Electronic parts are used throughout industry to run everyday products, such as cell phones, and also highly technical products, such as aircraft, missiles, and spacecraft. Unlike cell phones, which are often replaced every year, the highly technical products may remain in service from 20 to more than 80 years. But what happens if the original electronic part, with a life cycle of 18 months, is no longer available? Some manufacturers have discovered that they have unwittingly purchased counterfeit ones. Counterfeit Electronic Parts and Their Impact on Supply Chains examines how these items are negatively affecting the aviation, spacecraft, and defense sectors and what can be done about it. As the inflow of counterfeit electronic parts does not appear to be slowing down, Counterfeit Electronic Parts and Their Impact on Supply Chains investigates the possible solutions to combat the issue, including legislation and standards, and other solutions that are government driven but that may be impacted by continuing budget cuts. The book also presents a high-level compilation of supply chain best practices identified in a survey of electronic parts manufacturers and government contractors. It is a must-read for those interested in a comprehensive review of the challenge of counterfeit electronic parts and the consequences of their use in both consumer and industrial products.

In 2010 the inaugural U.S. Joint Strategic Plan on Intellectual Property Enforcement (Strategy) was issued. It was developed as a result of public input and the efforts of Fed. agencies. The Strategy included 33 action items to improve intellectual property enforcement, falling into six categories. This report shows how the U.S. Gov't. has implemented the action items and taken steps to improve enforcement, in order to grow the U.S. economy; create jobs and support U.S. exports; promote innovation and the security of America's comparative advantage in the global economy; protect consumer trust and safety; protect national and economic security; and validate rights protected under our Constitution. Illus. This is a print on demand report.

Globalization of the integrated circuit (IC) supply chains led to many potential vulnerabilities. Several attack scenarios can exploit these vulnerabilities to reverse engineer IC designs or to insert malicious trojan circuits. Split manufacturing refers to the process of splitting an IC design into multiple parts and fabricating these parts at two or more foundries such that the design is secure even when some or all of those foundries are potentially untrusted. Realizing its security benefits, researchers have proposed split fabrication methods for 2D, 2.5D, and the emerging 3D ICs. Both attack methods against split designs and defense techniques to thwart those attacks while minimizing overheads have steadily progressed over the past decade. This book presents a comprehensive review of the state-of-the-art and emerging directions in design splitting for secure split fabrication, design recognition and recovery attacks against split designs, and design techniques to defend against those attacks. Readers will learn methodologies for secure and trusted IC design and fabrication using split design methods to protect against supply chain vulnerabilities.

In this volume, we have put together papers spanning a broad range — from the area of modeling of strain and misfit dislocation densities, microwave absorption characteristics of nanocomposites, to X-ray diffraction studies.Specific topics in this volume include:In summary, papers selected in this volume cover various aspects of high performance logic and circuits for high-speed electronic systems.