Encapsulation Technologies For Electronic Applications
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Encapsulation Technologies for Electronic Applications
Author | : Haleh Ardebili,Jiawei Zhang,Michael Pecht |
Publsiher | : William Andrew |
Total Pages | : 508 |
Release | : 2018-10-23 |
Genre | : Technology & Engineering |
ISBN | : 9780128119792 |
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Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Includes coverage of environmentally friendly 'green encapsulants' Presents coverage of faults and defects, and how to analyze and avoid them
Flexible Electronic Packaging and Encapsulation Technology
Author | : Hong Meng,Wei Huang |
Publsiher | : John Wiley & Sons |
Total Pages | : 389 |
Release | : 2024-03-25 |
Genre | : Technology & Engineering |
ISBN | : 9783527845712 |
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Flexible Electronic Packaging and Encapsulation Technology A systematic introduction to the future of electronic packaging Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential. Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems. Flexible Electronic Packaging and Encapsulation Technology readers will also find: Survey of commercial electronic packaging materials and patents for reference purposes Guidelines for designing high-performance packaging materials with novel structures An authorial team of leading researchers in the field Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.
Printed Electronics
Author | : Zheng Cui |
Publsiher | : John Wiley & Sons |
Total Pages | : 355 |
Release | : 2016-09-26 |
Genre | : Technology & Engineering |
ISBN | : 9781118920923 |
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This book provides an overview of the newly emerged and highly interdisciplinary field of printed electronics • Provides an overview of the latest developments and research results in the field of printed electronics • Topics addressed include: organic printable electronic materials, inorganic printable electronic materials, printing processes and equipments for electronic manufacturing, printable transistors, printable photovoltaic devices, printable lighting and display, encapsulation and packaging of printed electronic devices, and applications of printed electronics • Discusses the principles of the above topics, with support of examples and graphic illustrations • Serves both as an advanced introductory to the topic and as an aid for professional development into the new field • Includes end of chapter references and links to further reading
Surface Modification Technologies XIV
Author | : T. S. Sudarshan |
Publsiher | : CRC Press |
Total Pages | : 672 |
Release | : 2001 |
Genre | : Science |
ISBN | : UVA:X004555747 |
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The British National Bibliography
Author | : Arthur James Wells |
Publsiher | : Unknown |
Total Pages | : 2744 |
Release | : 2009 |
Genre | : Bibliography, National |
ISBN | : STANFORD:36105211722686 |
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IEEE CPMT International Electronic Manufacturing Technology Symposium proceedings
Author | : Anonim |
Publsiher | : Unknown |
Total Pages | : 194 |
Release | : 1998 |
Genre | : Electronic apparatus and appliances |
ISBN | : UOM:39015040307921 |
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SAMPE Quarterly
Author | : Society for the Advancement of Material and Process Engineering,Society of Aerospace Material and Process Engineers |
Publsiher | : Unknown |
Total Pages | : 280 |
Release | : 1991 |
Genre | : Airplanes |
ISBN | : UVA:X002287524 |
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Nitride Semiconductor Light Emitting Diodes LEDs
Author | : Jian-Jang Huang,Hao-Chung Kuo,Shyh-Chiang Shen |
Publsiher | : Woodhead Publishing |
Total Pages | : 650 |
Release | : 2014-02-14 |
Genre | : Technology & Engineering |
ISBN | : 9780857099303 |
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The development of nitride-based light-emitting diodes (LEDs) has led to advancements in high-brightness LED technology for solid-state lighting, handheld electronics, and advanced bioengineering applications. Nitride Semiconductor Light-Emitting Diodes (LEDs) reviews the fabrication, performance, and applications of this technology that encompass the state-of-the-art material and device development, and practical nitride-based LED design considerations. Part one reviews the fabrication of nitride semiconductor LEDs. Chapters cover molecular beam epitaxy (MBE) growth of nitride semiconductors, modern metalorganic chemical vapor deposition (MOCVD) techniques and the growth of nitride-based materials, and gallium nitride (GaN)-on-sapphire and GaN-on-silicon technologies for LEDs. Nanostructured, non-polar and semi-polar nitride-based LEDs, as well as phosphor-coated nitride LEDs, are also discussed. Part two covers the performance of nitride LEDs, including photonic crystal LEDs, surface plasmon enhanced LEDs, color tuneable LEDs, and LEDs based on quantum wells and quantum dots. Further chapters discuss the development of LED encapsulation technology and the fundamental efficiency droop issues in gallium indium nitride (GaInN) LEDs. Finally, part three highlights applications of nitride LEDs, including liquid crystal display (LCD) backlighting, infrared emitters, and automotive lighting. Nitride Semiconductor Light-Emitting Diodes (LEDs) is a technical resource for academics, physicists, materials scientists, electrical engineers, and those working in the lighting, consumer electronics, automotive, aviation, and communications sectors. Reviews fabrication, performance, and applications of this technology that encompass the state-of-the-art material and device development, and practical nitride-based LED design considerations Covers the performance of nitride LEDs, including photonic crystal LEDs, surface plasmon enhanced LEDs, color tuneable LEDs, and LEDs based on quantum wells and quantum dots Highlights applications of nitride LEDs, including liquid crystal display (LCD) backlighting, infra-red emitters, and automotive lighting