Grain Boundary Engineering Of Electronic Ceramics

One of the key technologies needed to understand and develop the mechanical and electrical properties of ceramics is the field of grain boundary engineering. This book covers new developments in this important field and addresses topics from grain boundary phenomena to grain boundary quantum structures, including the development of new techniques such as multifunctional electronmicroscopes, various kinds of spectroscopic analysis, and first principles calculations. Proceedings of the Japan Fine Ceramics Center Workshop, March 15-17, 2000, in Nagoya, Japan; Ceramic Transactions, Volume 118.

COST is a European programme promoting co-operation in science and technology. Today there are over 200 active COST networks (or so-called Actions) operating in 32 countries. Of these Actions, 13 are in the materials sector. This book contains the proceedings of COST 525: 'Advanced Electroceramics - Grain Boundary Engineering', the main objective of which is to understand the role played by grain boundaries in controlling the manufacture, microstructure and properties of electronic ceramics. The increase in knowledge should lead to the development of materials with enhanced properties, improved stability, reduced component costs, and the possibility of new opportunities for existing and developing ceramics.

The proceedings of the November 1990 symposium, held in conjunction with the PAC RIM Meeting, comprise papers organized under five headings: overview (5 papers); ferrites and titanates (13 papers); varistors and conductors (9 papers); high-temperature superconductors (4 papers); and processing and c

This book focuses on the properties and configuration of the ceramic which facilitates proper application of material to the task at hand. It is intended for workers in electronics, ceramics, computers, or telecommunications fields, to broaden their expertise in the area of electronic ceramics.

Presents papers from the workshop on the application of grain boundary phenomena to materials and processing design. Topics covered include electronic materials, evaluation methods, structural materials, and interfaces. Includes an overview of current research in grain-boundary-assisted materials pr