Heat Transfer In Microelectronic Equipment

With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.

To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting. This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging. Contents:A Review of Cooling Road Maps for 3D Chip Packages (Dereje Agonafer)Thermal Performance Mapping of Direct Liquid Cooled 3D Chip Stacks (Karl J L Geisler and Avram Bar-Cohen)Dynamic Thermal Management Considering Accurate Temperature-Leakage Interdependency (Bing Shi and Ankur Srivastava)Energy Reduction and Performance Maximization Through Improved Cooling (David Copeland)Optimal Choice of Heat Sinks from an Industrial Point of View (Clemens J M Lasance)Synthetic Jets for Heat Transfer Augmentation in Microelectronics Systems (Mehmet Arik and Enes Tamdogan)Recent Advance in Thermoelectric Devices for Electronics Cooling (Peng Wang)Energy Efficient Solid-State Cooling for Hot Spot Removal (Kazuaki Yazawa, Andrei Fedorov, Yogendra Joshi and Ali Shakouri)An Overview of the Use of Phase Change Materials for the Thermal Management of Transient Portable Electronics: Benefits and Challenges (Amy S Fleischer)Estimation of Cooling Performance of Phase Change Material (PCM) Module (Masaru Ishizuka and Tomoyuki Hatakeyama)Optimization Under Uncertainty for Electronics Cooling Design (Karthik K Bodla, Jayathi Y Murthy and Suresh V Garimella)Hydrophilic CNT-Sintered Copper Composite Wick for Enhanced Cooling (Glen A Powell, Anuradha Bulusu, Justin A Weibel, Sungwon S Kim, Suresh V Garimella and Timothy S Fisher)A Cabinet Level Thermal Test Vehicle to Evaluate Hybrid Double-Sided Cooling Schemes (Qihong Nie and Yogendra Joshi)Energy Efficiency and Reliability Risk Mitigation of Data Centers Through Prognostics and Health Management (Jun Dai, Michael Ohadi and Michael Pecht)Damage Pre-Cursors Based Assessment of Accrued Thermomechanical Damage and Remaining Useful Life in Field Deployed Electronics (Pradeep Lall, Mahendra Harsha, Kai Goebel and Jim Jones)Towards Embedded Cooling — Gen 3 Thermal Packaging Technology (Avram Bar-Cohen) Readership: Researchers, practitioners, and postgraduates in mechanical engineering, nanoelectronics, computer engineering, and electrical & electronic engineering. Keywords:Electronics Cooling;Electronics Packaging;Thermal Management;Thermal Sciences;Electronics Reliability;Thermoelectrics;Computational Heat Transfer;Liquid Cooling

Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.

Examining one of the major heat transfer issues of the decade, this reference volume presents new contributions from international researchers. The volume contains information on thermal control of devices from microelectronic chips in computers to devices for power conversion.

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics. Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling? The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.