Inertial Electrostatic Confinement Iec Fusion

This book provides readers with an introductory understanding of Inertial Electrostatic Confinement (IEC), a type of fusion meant to retain plasma using an electrostatic field. IEC provides a unique approach for plasma confinement, as it offers a number of spin-off applications, such as a small neutron source for Neutron Activity Analysis (NAA), that all work towards creating fusion power. The IEC has been identified in recent times as an ideal fusion power unit because of its ability to burn aneutronic fuels like p-B11 as a result of its non-Maxwellian plasma dominated by beam-like ions. This type of fusion also takes place in a simple mechanical structure small in size, which also contributes to its viability as a source of power. This book posits that the ability to study the physics of IEC in very small volume plasmas makes it possible to rapidly investigate a design to create a power-producing device on a much larger scale. Along with this hypothesis the book also includes a conceptual experiment proposed for demonstrating breakeven conditions for using p-B11 in a hydrogen plasma simulation. This book also: Offers an in-depth look, from introductory basics to experimental simulation, of Inertial Electrostatic Confinement, an emerging method for generating fusion power Discusses how the Inertial Electrostatic Confinement method can be applied to other applications besides fusion through theoretical experiments in the text Details the study of the physics of Inertial Electrostatic Confinement in small-volume plasmas and suggests that their rapid reproduction could lead to the creation of a large-scale power-producing device Perfect for researchers and students working with nuclear fusion, Inertial Electrostatic Confinement (IEC) Fusion: Fundamentals and Applications also offers the current experimental status of IEC research, details supporting theories in the field and introduces other potential applications that stem from IEC.

This work summarizes the state-of-the-art development of inertial electrostatic confinement (IEC) thruster, which can be divided into two parallel lines of development: the IEC plasma source and the corresponding electromagnetic nozzle (EMN). Both developing lines start from the establishment of the theory and modeling and evolve to the design implementation and experimental verification. The IEC discharge model highlights a novel perspective on the IEC discharge physics and the impacts of the respective critical parameters, which layouts the design for the IEC plasma source. Experimental verification for the theory is demonstrated via the optical emission spectroscopy and collision radiative model. The results provide conclusive evidence of forming a spherical double layer within the IEC plasma source, which is the key to establishing the proposed IEC discharge theory in this work. This work presents a comprehensive study on the magnetohydrodynamic theory for assessing the plasma acceleration in the magnetic nozzle. Nevertheless, the result shows a performance limitation of the magnetic nozzle. An innovative invention is proposed to overcome the limitation known as the EMN. Thorough descriptions of EMN and its working principle are summarized in this work, including its effects on plasma confinement, acceleration, and detachment. Investigation of the plasma plume properties by miscellaneous plasma diagnostics tools further demonstrates EMN functionality and constitutes the first IECT prototype with proof-of-concept in literature.

Life at the Center of the Energy Crisis: A Technologist''s Search for a Black Swan describes the story of the author''s work and struggles in the field of energy research. The author''s experience in the field spans from work with Admiral Rickover and the Nuclear Navy to research with NASA designing propulsion for spacecraft to travel to Mars. The book provides insights into the differences between nuclear research done during the Cold War by the two superpowers, and offers a commentary on the flaws in each system with hope for change in the future. The book also provides a look into the development of the nuclear engineering program at the University of Illinois from the author''s years as a professor and an administrator.

This volume provides the first comprehensive look at a pivotal new technology in integrated circuit fabrication. For some time researchers have sought alternate processes for interconnecting the millions of transistors on each chip because conventional physical vapor deposition can no longer meet the specifications of today's complex integrated circuits. Out of this research, ionized physical vapor deposition has emerged as a premier technology for the deposition of thin metal films that form the dense interconnect wiring on state-of-the-art microprocessors and memory chips. For the first time, the most recent developments in thin film deposition using ionized physical vapor deposition (I-PVD) are presented in a single coherent source. Readers will find detailed descriptions of relevant plasma source technology, specific deposition systems, and process recipes. The tools and processes covered include DC hollow cathode magnetrons, RF inductively coupled plasmas, and microwave plasmas that are used for depositing technologically important materials such as copper, tantalum, titanium, TiN, and aluminum. In addition, this volume describes the important physical processes that occur in I-PVD in a simple and concise way. The physical descriptions are followed by experimentally-verified numerical models that provide in-depth insight into the design and operation I-PVD tools. Practicing process engineers, research and development scientists, and students will find that this book's integration of tool design, process development, and fundamental physical models make it an indispensable reference. Key Features: The first comprehensive volume on ionized physical vapor deposition Combines tool design, process development, and fundamental physical understanding to form a complete picture of I-PVD Emphasizes practical applications in the area of IC fabrication and interconnect technology Serves as a guide to select the most appropriate technology for any deposition application *This single source saves time and effort by including comprehensive information at one's finger tips *The integration of tool design, process development, and fundamental physics allows the reader to quickly understand all of the issues important to I-PVD *The numerous practical applications assist the working engineer to select and refine thin film processes