Mechanic And Dielectric Properties

Mechanic and Dielectric Properties deals with the mechanical and dielectric properties of thin films. Topics covered range from the deposition and mechanical properties of superlattice thin films to the preparation of hard coatings by sputtering and arc evaporation. The use of thin films in microwave acoustics is also discussed, along with ferroelectric films for integrated electronics and the physics, chemistry, and technology of electrochromic tungsten-oxide-based thin films. Comprised of five chapters, this volume begins with an analysis of the growth, characterization, and mechanical behavior of films comprising multilayers primarily of metal and refractory metallic compound components. The next chapter reviews the mechanical properties of hard coatings prepared by sputtering and arc evaporation, together with the influence of multilayer and gradient structures, and of film crystallinity, crystal orientation, and morphology, on properties such as hardness, coating smoothness, and friction behavior. Subsequent chapters focus on the unique role played by piezoelectric films in signal processing devices utilizing bulk or surface acoustic waves; the properties and applications of ferroelectric films in integrated electronics; and the underlying physics and chemistry of electrochromic tungsten-oxide-based thin films. This book should be of interest to physicists.

This book addresses the most important aspects of solid state physics, reviewing basic properties, related experimental techniques, and summarizing research over six decades. In addition, Micro- and Macro-Properties of Solids provides data on new materials such as rare-earth metals, semiconductors, ferroelectrics, mixed-valence compounds, superionic conductors, optical and optoelectronic materials and biomaterials.

As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.

Recently, several applications, primarily driven by microtechnology, have emerged where the use of materials with tailored electromagnetic (dielectric) properties are necessary for a successful overall design. The ``tailored'' aggregate properties are achieved by combining an easily moldable base matrix with particles having dielectric properties that are chosen to deliver (desired) effective properties. In many cases, the analysis of such materials requires the simulation of the macroscopic and microscopic electromagnetic response, as well as its resulting coupled thermal response, which can be important to determine possible failures in ``hot spots.'' This necessitates a stress analysis. Furthermore, because, oftentimes, such processes initiate degratory chemical processes, it can be necessary to also include models for these processes as well. A central objective of this work is to provide basic models and numerical solution strategies to analyze the coupled response of such materials by direct simulation using standard laptop/desktop equipment. Accordingly, this monograph covers: (1) The foundations of Maxwell's equations, (2) Basic homogenization theory, (3) Coupled systems (electromagnetic, thermal, mechanical and chemical), (4) Numerical methods and (5) An introduction to select biological problems. The text can be viewed as a research monograph suitable for use in an upper-division undergraduate or first year graduate course geared towards students in the applied sciences, mechanics and mathematics that have an interest in the analysis of particulate materials.

Each of the eight chapters treats an important aspect of solid state physics, comprising a complete review of the particular field. Typically, a chapter starts with basic information about a property of a solid and the related experimental techniques. This is followed by a global overview which brings together all important contributions by different research workers in the field. This overview is comprehensive and covers essential literature over the past 60 years. Each chapter concludes with a detailed discussion of the contributions made by the chapter authors and their associates, in some cases spanning the last 45 years. In addition, Micro- and Macro-Properties of Solids provides data on new materials such as rare-earth metals, semiconductors, ferroelectrics, mixed-valence compounds, superionic conductors, optical and optoelectronic materials and biomaterials.

Physicists, chemists and electrical engineers are all interested in the properties of dielectric materials, though with different purposes in mind. This book is intended to give a systematic account of the theory of dielectric properties, and thus to provide a bavkground against which applications can be made. The book seldom requires on the part of the rteader a knowledge of mathematics greater than is implied by an acquantance with calculus. The reader is assumed to have a certain elementary knowledhge of atomic and molecular physics, statistical mechanics, and electrostatics.

This book provides information on characterizing the microstructure and mechanical properties of cementitious materials at microscale. Specifically, with the intention to provide the methods of preparing the samples for the micro-scale mechanical testing, to address the techniques for measuring and analyzing the elastic modulus, the stiffness, and the fracture toughness of cementitious materials at micro scale by instrumented indentation, to describe a method for measuring and interpreting creep behavior of cementitious materials at micro scale, and to demonstrate the homogenization method for obtaining the mechanical properties of cementitious materials across scales. The information in this book is helpful to a wide readership in the field of civil engineering and materials science working with cementitious materials and other composite materials.