Nanopackaging From Nanomaterials To The Atomic Scale

This book is a first attempt to merge two different communities: scientists and technologists. Therefore, it is not a general overview covering all the fields of nanopackaging, but is mainly focused on two topics. The first topic deals with atomic scale devices or circuit requirements, as well as related recent technological developments; for example, surface science engineering and atomic scale interconnects studies. The second main part of the book brings CNT nano-materials solutions for resolving interconnect or thermal management problems in microelectronics device packaging. This book is not just useful for those who attended the International Workshop on Nanopackaging in Grenoble, but can provide valuable information to scientists and technologists in the nanopackaging community.

This book is a first attempt to merge two different communities: scientists and technologists. Therefore, it is not a general overview covering all the fields of nanopackaging, but is mainly focused on two topics. The first topic deals with atomic scale devices or circuit requirements, as well as related recent technological developments; for example, surface science engineering and atomic scale interconnects studies. The second main part of the book brings CNT nano-materials solutions for resolving interconnect or thermal management problems in microelectronics device packaging. This book is not just useful for those who attended the International Workshop on Nanopackaging in Grenoble, but can provide valuable information to scientists and technologists in the nanopackaging community.

Written by leading international experts, this book summarizes the advances in sample preparation, design and construction of dangling bond atomic scale wires and logic gate circuits at the surface of a passivated semi-conductor. Individual chapters cover different aspects of the sample fabrication from research and development point of view, present design and construction as well as microscopic and spectroscopic characteristics of single dangling atomic wires and logic gates, and discuss the tools for design of large atomic scale circuit on a surface.This edited volume includes selected contributions from the “International Workshop on Atomic Wires” held in Krakow in September 2014 completed and updated with most current results up to mid-2016, and offers for the first time an overview of up-to-date knowledge in the burgeoning field of atomic scale circuits. The book will appeal to researchers and scholars interested in nanoscience and its various sub-fields including, in particular, molecular electronics, atomic scale electronics and nanoelectronics.

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.

This book draws on the main themes covered during the International Workshop on Molecular Architectonics which took place in Shiretoko, Japan from August 3 to 6, 2015. The concepts and results explored in this book relate to the term “molecular architectonics” which stands for electronic, optical and information-processing functions being orchestrated by molecular assemblies. This area is defined as the third stage of single-molecule electronics and builds on stage one, where measurements were performed on single-molecule layered films, and stage two, the resulting quantitative analyses. In this work, experts come together to write about the most important aspects of molecular architectonics. This interdisciplinary, visionary and unique book is of interest to scientists working on electronic materials, surface science and information processing sciences using noise and fluctuation.

This book provides readers with an incisive look at cutting-edge peridynamic modeling methods, numerical techniques, their applications, and potential future directions for the field. It starts with an introductory chapter authored by Stewart Silling, who originally developed peridynamics. It then looks at new concepts in the field, with chapters covering dual-horizon peridynamics, peridynamics for axisymmetric analysis, beam and plate models in peridynamics, coupled peridynamics and XFEM, peridynamics for dynamic fracture modeling, and more. From there, it segues into coverage of cutting-edge applications of peridynamics, exploring its biological applications, modeling at the nanoscale, peridynamics for composites delamination and damage in ceramics, and more, concluding with a chapter on the application of artificial intelligence and machine learning in peridynamics. Covers modeling methods, numerical techniques, applications, and future directions for the field Discusses techniques such as dual-horizon peridynamics, damage modeling using the phase-field approach, and contact analysis of rigid and deformable bodies with refined non-ordinary state-based peridynamics Looks at a range of different peridynamic applications such as ice modeling, fiber-reinforced composite modeling, modeling at nanoscale, and more

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.