On And Off Chip Crosstalk Avoidance In Vlsi Design

Deep Sub-Micron (DSM) processes present many changes to Very Large Scale Integration (VLSI) circuit designers. One of the greatest challenges is crosstalk, which becomes significant with shrinking feature sizes of VLSI fabrication processes. The presence of crosstalk greatly limits the speed and increases the power consumption of the IC design. This book focuses on crosstalk avoidance with bus encoding, one of the techniques that selectively mitigates the impact of crosstalk and improves the speed and power consumption of the bus interconnect. This technique encodes data before transmission over the bus to avoid certain undesirable crosstalk conditions and thereby improve the bus speed and/or energy consumption.

This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.

Offering first-hand insights by top scientists and industry experts at the forefront of R&D into nanoelectronics, this book neatly links the underlying technological principles with present and future applications. A brief introduction is followed by an overview of present and emerging logic devices, memories and power technologies. Specific chapters are dedicated to the enabling factors, such as new materials, characterization techniques, smart manufacturing and advanced circuit design. The second part of the book provides detailed coverage of the current state and showcases real future applications in a wide range of fields: safety, transport, medicine, environment, manufacturing, and social life, including an analysis of emerging trends in the internet of things and cyber-physical systems. A survey of main economic factors and trends concludes the book. Highlighting the importance of nanoelectronics in the core fields of communication and information technology, this is essential reading for materials scientists, electronics and electrical engineers, as well as those working in the semiconductor and sensor industries.

This practical, tool-independent guide to designing digital circuits takes a unique, top-down approach, reflecting the nature of the design process in industry. Starting with architecture design, the book comprehensively explains the why and how of digital circuit design, using the physics designers need to know, and no more.

This book explains the application of recent advances in computational intelligence – algorithms, design methodologies, and synthesis techniques – to the design of integrated circuits and systems. It highlights new biasing and sizing approaches and optimization techniques and their application to the design of high-performance digital, VLSI, radio-frequency, and mixed-signal circuits and systems. This second of two related volumes addresses digital and network designs and applications, with 12 chapters grouped into parts on digital circuit design, network optimization, and applications. It will be of interest to practitioners and researchers in computer science and electronics engineering engaged with the design of electronic circuits.

This book constitutes revised selected papers from the 8th International Workshop on Constructive Side-Channel Analysis and Secure Design, COSADE 2017, held in Paris, France, in April 2017. The 17 papers presented in this volume were carefully reviewed and selected from numerous submissions. They were organized in topical sections named: Side-Channel Attacks and Technological Effects; Side-Channel Countermeasures; Algorithmic Aspects in Side-Channel Attacks; Side-Channel Attacks; Fault Attacks; Embedded Security; and Side-Channel Tools.

The book constitutes peer-reviewed proceedings of a workshop on Emerging Electronics Devices, Circuits, and Systems (EEDCS) held in conjunction with International Symposium on Devices, Circuits, and Systems (ISDCS 2022). The book focuses on the recent development in devices, circuits, and systems. It also discusses innovations, trends, practical challenges, and solutions adopted in device design, modeling, fabrication, characterization, and their circuit implementation with pertinent system applications. It will be useful for researchers, developers, engineers, academicians, and students.

This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book "Signal Propagation on Interconnects", Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.