Physical Layer Multi Core Prototyping

Base stations developed according to the 3GPP Long Term Evolution (LTE) standard require unprecedented processing power. 3GPP LTE enables data rates beyond hundreds of Mbits/s by using advanced technologies, necessitating a highly complex LTE physical layer. The operating power of base stations is a significant cost for operators, and is currently optimized using state-of-the-art hardware solutions, such as heterogeneous distributed systems. The traditional system design method of porting algorithms to heterogeneous distributed systems based on test-and-refine methods is a manual, thus time-expensive, task. Physical Layer Multi-Core Prototyping: A Dataflow-Based Approach provides a clear introduction to the 3GPP LTE physical layer and to dataflow-based prototyping and programming. The difficulties in the process of 3GPP LTE physical layer porting are outlined, with particular focus on automatic partitioning and scheduling, load balancing and computation latency reduction, specifically in systems based on heterogeneous multi-core Digital Signal Processors. Multi-core prototyping methods based on algorithm dataflow modeling and architecture system-level modeling are assessed with the goal of automating and optimizing algorithm porting. With its analysis of physical layer processing and proposals of parallel programming methods, which include automatic partitioning and scheduling, Physical Layer Multi-Core Prototyping: A Dataflow-Based Approach is a key resource for researchers and students. This study of LTE algorithms which require dynamic or static assignment and dynamic or static scheduling, allows readers to reassess and expand their knowledge of this vital component of LTE base station design.

The first of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC System Design, Verification, and Testing thoroughly examines system-level design, microarchitectural design, logic verification, and testing. Chapters contributed by leading experts authoritatively discuss processor modeling and design tools, using performance metrics to select microprocessor cores for integrated circuit (IC) designs, design and verification languages, digital simulation, hardware acceleration and emulation, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on high-level synthesis, system-on-chip (SoC) block-based design, and back-annotating system-level models Offering improved depth and modernity, Electronic Design Automation for IC System Design, Verification, and Testing provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.

With the increased functionality demand for mobile speed and access in our everyday lives, broadband wireless networks have emerged as the solution in providing high data rate communications systems to meet these growing needs. Broadband Wireless Access Networks for 4G: Theory, Application, and Experimentation presents the latest trends and research on mobile ad hoc networks, vehicular ad hoc networks, and routing algorithms which occur within various mobile networks. This publication smartly combines knowledge and experience from enthusiastic scholars and expert researchers in the area of wideband and broadband wireless networks. Students, professors, researchers, and other professionals in the field will benefit from this book’s practical applications and relevant studies.

Smart Antennas—State of the Art brings together the broad expertise of 41 European experts in smart antennas. They provide a comprehensive review and an extensive analysis of the recent progress and new results generated during the last years in almost all fields of smart antennas and MIMO (multiple-input multiple-output) transmission. The following represents a summarized table of content.Receiver: space-time processing, antenna combining, reduced rank processing, robust beamforming, subspace methods, synchronization, equalization, multiuser detection, iterative methods Channel: propagation, measurements and sounding, modelling, channel estimation, direction-of-arrival estimation, subscriber location estimation Transmitter: space-time block coding, channel side information, unified design of linear transceivers, ill-conditioned channels, MIMO-MAC strategies Network Theory: channel capacity, network capacity, multihop networks Technology: antenna design, transceivers, demonstrators and testbeds, future air interfaces Applications and Systems: 3G system and link level aspects, MIMO HSDPA, MIMO-WLAN/UMTS implementation issues This book serves as a reference for scientists and engineers who need to be aware of the leading edge research in multiple-antenna communications, an essential technology for emerging broadband wireless systems.

This book documents some of the most recent advances on the physical layer of the Internet of Things (IoT), including sensors, circuits, and systems. The application area selected for illustrating these advances is that of autonomous, wearable systems for real-time medical diagnosis. The book is unique in that it adopts a holistic view of such systems and includes not only the sensor and processing subsystems, but also the power, communication, and security subsystems. Particular attention is paid to the integration of these IoT subsystems as well as the prototyping platforms needed for achieving such integration. Other unique features include the discussion of energy-harvesting subsystems to achieve full energy autonomy and the consideration of hardware security as a requirement for the integrity of the IoT physical layer. One unifying thread of the various designs considered in this book is that they have all been fabricated and tested in an advanced, low-power CMOS process, namely GLOBALFOUNDRIES 65nm CMOS LPe.

This book is the proceedings volume of the 10th International Conference on Field Programmable Logic and its Applications (FPL), held August 27 30, 2000 in Villach, Austria, which covered areas like reconfigurable logic (RL), reconfigurable computing (RC), and its applications, and all other aspects. Its subtitle "The Roadmap to Reconfigurable Computing" reminds us, that we are currently witnessing the runaway of a breakthrough. The annual FPL series is the eldest international conference in the world covering configware and all its aspects. It was founded 1991 at Oxford University (UK) and is 2 years older than its two most important competitors usually taking place at Monterey and Napa. FPL has been held at Oxford, Vienna, Prague, Darmstadt, London, Tallinn, and Glasgow (also see: http://www. fpl. uni kl. de/FPL/). The New Case for Reconfigurable Platforms: Converging Media. Indicated by palmtops, smart mobile phones, many other portables, and consumer electronics, media such as voice, sound, video, TV, wireless, cable, telephone, and Internet continue to converge. This creates new opportunities and even necessities for reconfigurable platform usage. The new converged media require high volume, flexible, multi purpose, multi standard, low power products adaptable to support evolving standards, emerging new standards, field upgrades, bug fixes, and, to meet the needs of a growing number of different kinds of services offered to zillions of individual subscribers preferring different media mixes.

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.

A Multi-Processor System-on-Chip (MPSoC) is the key component for complex applications. These applications put huge pressure on memory, communication devices and computing units. This book, presented in two volumes – Architectures and Applications – therefore celebrates the 20th anniversary of MPSoC, an interdisciplinary forum that focuses on multi-core and multi-processor hardware and software systems. It is this interdisciplinarity which has led to MPSoC bringing together experts in these fields from around the world, over the last two decades. Multi-Processor System-on-Chip 2 covers application-specific MPSoC design, including compilers and architecture exploration. This second volume describes optimization methods, tools to optimize and port specific applications on MPSoC architectures. Details on compilation, power consumption and wireless communication are also presented, as well as examples of modeling frameworks and CAD tools. Explanations of specific platforms for automotive and real-time computing are also included.