Proceedings Of The 6th Symposium On Ultrasonic Electronics

Radiation acoustics is a developing field lying at the intersection of acoustics, high-energy physics, nuclear physics, and condensed matter physics. Radiation Acoustics is among the first books to address this promising field of study, and the first to collect all of the most significant results achieved since research in this area began in earnest in the 1970s. The book begins by reviewing the data on elementary particles, absorption of penetrating radiation in a substance, and the mechanisms of acoustic radiation excitation. The next seven chapters present a theoretical treatment of thermoradiation sound generation in condensed media under the action of modulated penetrating radiation and radiation pulses. The author explores particular features of the acoustic fields of moving thermoradiation sound sources, sound excitation by single high-energy particles, and the efficiency and optimal conditions of thermoradiation sound generation. Experimental results follow the theoretical discussions, and these clearly demonstrate the validity of the thermoradiation theory. The book concludes with discussions on applications, including the large-scale DUMAND and GENIUS projects now on the horizon. Radiation acoustics holds enormous potential for applications in areas such as microelectronics, geophysics, and astrophysics. This book offers a unique opportunity to benefit from the approach and extensive experience of author Leonid N. Lyamshev, who in this, his last book, shows how he left an indelible mark on the world of acoustics.

Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products. Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part three discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells. This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It is a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering. Reviews the basics of nanojoining including solid-state bonding and fusion microwelding Covers microjoining and nanojoining processes such as bonding mechanisms and metallurgy, sensing and numerical modelling Examines applications of microjoining such as the manufacturing of medical devices, and the sealing of solid oxide fuel cells

Over the last decade, ultrasound mid-air haptic technology has emerged and rapidly advanced to engage multidisciplinary scientific communities within and adjacent to the haptics and HCI fields. Additionally, this haptic technology has been adopted by a number of industry sectors (e.g., automotive, virtual reality, digital signage, neuroscience research) who appear keen to exploit its unique value proposition: the ability to deliver rich haptic sensations from a distance, without the need to touch, wear or hold anything in order to enhance touchless interfaces, novel applications, and experiences. This book is the first, and currently the only one, that provides a comprehensive description of the technology, encapsulating almost all aspects relating to electronic prototyping, acoustics, haptics, psychology and perception, user experience and end-user HCI applications. Through its 18 chapters written by 30 expert co-authors, this book is therefore an excellent introduction to the technology for anyone coming from any of those fields. Specifically, the reader will benefit by getting a unique and multi-dimensional perspective on the state-of-the-art of this enabling haptic technology while also understanding its history, relevant best research practices, and an overview of the various open challenges and opportunities.