Robust Design Of Microelectronics Assemblies Against Mechanical Shock Temperature And Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study

This book consists of chapters dedicated to the questions of cyber-physical system design and its usage for the chemical industry and new material design. Also, the contribution of the book covers scientific research and their results for cyber-physical systems design and application in the energy domain and solutions regarding engineering education for cyber-physical systems design. The book offers unique content for researchers and practitioners who are looking for new knowledge and skills in the framework of Industry 4.0 solutions. The book also benefits researchers and practitioners in chemistry and new material design and manufacturing to understand how cyber-physical systems can be applied to increase efficiency and performance. The target audience of the book are practitioners, enterprises representatives, scientists, Ph.D. and master students who perform scientific research or applications of cyber-physical systems in the concept of Industry 4.0.

The book is unique in its emphasis on the road to scientific success rather than the science itself. Scientists communicate much on their science through research publications, but they tend to talk much less, if at all, on the challenges encountered on the road to success. Information on the road to scientific success is helpful to people that are considering embarking on the journey on this road or are in the middle of the journey on this road. These people need inspiration and encouragement. Unless the information is recorded, it would be lost.The objectives of this book series are to:

Contains the proceedings of IMAPS '97 in Adobe portable document format (PDF).

Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.

This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.