Semiconductor Cleaning Technology 1989
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Semiconductor cleaning technology 1989
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Author | : Jerzy Ruzyllo |
Publsiher | : Unknown |
Total Pages | : 399 |
Release | : 1990 |
Genre | : Electronic Book |
ISBN | : OCLC:634090250 |
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Semiconductor Cleaning Technology 1989
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Author | : Electrochemical Society. Dielectrics and Insulation Division |
Publsiher | : Unknown |
Total Pages | : 399 |
Release | : 1990 |
Genre | : Semiconductor wafers |
ISBN | : OCLC:39265821 |
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Proceedings of the Third Symposium on Silicon Nitride and Silicon Dioxide Thin Insulating Films
Author | : Vikram J. Kapoor,William D. Brown |
Publsiher | : The Electrochemical Society |
Total Pages | : 644 |
Release | : 1994 |
Genre | : Science |
ISBN | : 1566770483 |
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Cleaning Technology in Semiconductor Device Manufacturing
Author | : Anonim |
Publsiher | : The Electrochemical Society |
Total Pages | : 636 |
Release | : 2000 |
Genre | : Technology & Engineering |
ISBN | : 1566772591 |
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Proceedings of the Fifth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing
Author | : Jerzy Rużyłło |
Publsiher | : The Electrochemical Society |
Total Pages | : 668 |
Release | : 1998 |
Genre | : Technology & Engineering |
ISBN | : 1566771889 |
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Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 10
Author | : Takeshi Hattori |
Publsiher | : The Electrochemical Society |
Total Pages | : 497 |
Release | : 2007 |
Genre | : Microelectronics |
ISBN | : 9781566775687 |
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This issue covers topics related to the removal of contaminants from and conditioning of Si (SOI), SiC, Ge, SiGe, and III-V semiconductor surfaces; cleaning media, including non-aqueous cleaning methods and tools; front- and back-end cleaning operations; integrated cleaning; cleaning of MEMS; photomasks (reticles); porous low-k dielectrics; post-CMP cleaning; wafer bevel cleaning and polishing; characterization, evaluation, and monitoring of cleaning; correlation with device performance as well as cleaning of equipment and storage and handling hardware. The hardcover edition includes a bonus CD-ROM of Cleaning Technology in Semiconductor Device Manufacturing 1989?2007: Proceedings from the ECS Semiconductor Cleaning Symposia 1?10. This bonus material is not available with the PDF edition.
Handbook of Silicon Wafer Cleaning Technology
Author | : Karen Reinhardt,Werner Kern |
Publsiher | : William Andrew |
Total Pages | : 760 |
Release | : 2018-03-16 |
Genre | : Technology & Engineering |
ISBN | : 9780323510851 |
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Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal aspects. This revised edition includes the developments of the last ten years to accommodate a continually involving industry, addressing new technologies and materials, such as germanium and III-V compound semiconductors, and reviewing the various techniques and methods for cleaning and surface conditioning. Chapters include numerous examples of cleaning technique and their results. The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination. The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others. Focuses on cleaning techniques including wet, plasma and other surface conditioning techniques used to manufacture integrated circuits Reliable reference for anyone that manufactures integrated circuits or supplies the semiconductor and microelectronics industries Covers processes and equipment, as well as new materials and changes required for the surface conditioning process
Fundamentals of Semiconductor Processing Technology
Author | : Badih El-Kareh |
Publsiher | : Springer Science & Business Media |
Total Pages | : 620 |
Release | : 1994-12-31 |
Genre | : Technology & Engineering |
ISBN | : 0792395344 |
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The drive toward new semiconductor technologies is intricately related to market demands for cheaper, smaller, faster, and more reliable circuits with lower power consumption. The development of new processing tools and technologies is aimed at optimizing one or more of these requirements. This goal can, however, only be achieved by a concerted effort between scientists, engineers, technicians, and operators in research, development, and manufac turing. It is therefore important that experts in specific disciplines, such as device and circuit design, understand the principle, capabil ities, and limitations of tools and processing technologies. It is also important that those working on specific unit processes, such as lithography or hot processes, be familiar with other unit processes used to manufacture the product. Several excellent books have been published on the subject of process technologies. These texts, however, cover subjects in too much detail, or do not cover topics important to modem tech nologies. This book is written with the need for a "bridge" between different disciplines in mind. It is intended to present to engineers and scientists those parts of modem processing technologies that are of greatest importance to the design and manufacture of semi conductor circuits. The material is presented with sufficient detail to understand and analyze interactions between processing and other semiconductor disciplines, such as design of devices and cir cuits, their electrical parameters, reliability, and yield.