Thin Film Materials Processes And Reliability
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Thin Film Materials Processes and Reliability
Author | : G. S. Mathad |
Publsiher | : The Electrochemical Society |
Total Pages | : 69 |
Release | : 2008-09 |
Genre | : Science |
ISBN | : 9781566775908 |
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The symposium covered three topics: i) plasma processing for
Thin Film Materials Processes and Reliability
Author | : Electrochemical Society. Meeting |
Publsiher | : The Electrochemical Society |
Total Pages | : 232 |
Release | : 2001 |
Genre | : Technology & Engineering |
ISBN | : 1566773571 |
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Thin Film Materials Processes and Reliability
Author | : G. S. Mathad |
Publsiher | : The Electrochemical Society |
Total Pages | : 438 |
Release | : 2003 |
Genre | : Technology & Engineering |
ISBN | : 1566773938 |
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Proceedings of the International Symposium on Thin Film Materials Processes Reliability and Applications Thin Film Processes
Author | : G. S. Mathad,M. Meyyappan |
Publsiher | : The Electrochemical Society |
Total Pages | : 388 |
Release | : 1998 |
Genre | : Technology & Engineering |
ISBN | : 1566771838 |
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Electronic Thin Film Reliability
Author | : King-Ning Tu |
Publsiher | : Cambridge University Press |
Total Pages | : 413 |
Release | : 2010-11-25 |
Genre | : Technology & Engineering |
ISBN | : 9781139492706 |
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Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.
Low and High Dielectric Constant Materials
Author | : Rajendra Singh |
Publsiher | : The Electrochemical Society |
Total Pages | : 242 |
Release | : 2000 |
Genre | : Technology & Engineering |
ISBN | : 156677229X |
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The Materials Science of Thin Films
Author | : Milton Ohring |
Publsiher | : Academic Press |
Total Pages | : 744 |
Release | : 1992 |
Genre | : Science |
ISBN | : 012524990X |
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Prepared as a textbook complete with problems after each chapter, specifically intended for classroom use in universities.
Micro and Opto Electronic Materials and Structures Physics Mechanics Design Reliability Packaging
Author | : Ephraim Suhir,Y.C. Lee,C.P. Wong |
Publsiher | : Springer Science & Business Media |
Total Pages | : 1471 |
Release | : 2007-05-26 |
Genre | : Technology & Engineering |
ISBN | : 9780387329895 |
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This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.