Three Dimensional Integrated Circuit Design
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Three Dimensional Integrated Circuit Design
Author | : Vasilis F. Pavlidis,Ioannis Savidis,Eby G. Friedman |
Publsiher | : Newnes |
Total Pages | : 770 |
Release | : 2017-07-04 |
Genre | : Technology & Engineering |
ISBN | : 9780124104846 |
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Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization
Three Dimensional Integrated Circuit Design
Author | : Yuan Xie,Jingsheng Jason Cong,Sachin Sapatnekar |
Publsiher | : Springer Science & Business Media |
Total Pages | : 292 |
Release | : 2009-12-02 |
Genre | : Technology & Engineering |
ISBN | : 9781441907844 |
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We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).
Three Dimensional Integrated Circuits
Author | : Guangyu Sun,Yibo Chen,Xiangyu Dong,Yuan Xie,Jin Ouyang |
Publsiher | : Foundations and Trends(r) in E |
Total Pages | : 166 |
Release | : 2011-05 |
Genre | : Computers |
ISBN | : 1601984626 |
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Presents the background on 3D integration technology, and shows the major benefits offered by 3D integration. EDA design tools and methodologies for 3D ICs are reviewed. The cost of 3D integration is also analyzed.
Three Dimensional System Integration
Author | : Antonis Papanikolaou,Dimitrios Soudris,Riko Radojcic |
Publsiher | : Springer Science & Business Media |
Total Pages | : 251 |
Release | : 2010-12-07 |
Genre | : Architecture |
ISBN | : 9781441909626 |
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Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
Design for High Performance Low Power and Reliable 3D Integrated Circuits
Author | : Sung Kyu Lim |
Publsiher | : Springer Science & Business Media |
Total Pages | : 573 |
Release | : 2012-11-27 |
Genre | : Technology & Engineering |
ISBN | : 9781441995421 |
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This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.
Handbook of 3D Integration Volume 4
Author | : Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir |
Publsiher | : John Wiley & Sons |
Total Pages | : 488 |
Release | : 2019-05-06 |
Genre | : Technology & Engineering |
ISBN | : 9783527338559 |
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This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Three Dimensional Integrated Circuit Layout
Author | : Andrew Harter,A. C. Harter |
Publsiher | : Cambridge University Press |
Total Pages | : 241 |
Release | : 1991-11-28 |
Genre | : Computers |
ISBN | : 9780521416306 |
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First published in 1991, this thesis concentrates upon the design of three-dimensional, rather than the traditional two-dimensional, circuits. The theory behind such circuits is presented in detail, together with experimental results.
Design of 3D Integrated Circuits and Systems
Author | : Rohit Sharma |
Publsiher | : CRC Press |
Total Pages | : 328 |
Release | : 2018-09-03 |
Genre | : Technology & Engineering |
ISBN | : 9781351831598 |
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Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.