Tribo Chemical Mechanisms Of Copper Chemical Mechanical Planarization Cmp

Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP

This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.

The role that friction and contact play in the processes of wear and planarization on material surfaces is central to the understanding of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization presents a detailed account of the CMP process in a language that is suitable for tribology professionals as well as chemists, materials scientists, physicists, and other applied scientists and engineers in fields of semiconductors and microelectronics. The first half of the book is devoted to CMP, while the other focuses on the fundamentals of tribology. As the first source to integrate CMP and tribology, the book illustrates the important role that these fields play in manufacturing and technological development. It follows with an examination of tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects. Other topics covered in depth include basics of friction, flash temperature, lubrication fundamentals, basics of wear, polishing particles, and pad wear. The book concludes its focus with CMP practices, discussing mechanical aspects, pad materials, elastic modulus, and cell buckling. Expanding upon the science and technology of tribology to improve the reliability, maintenance, and wear of technical equipment and other material applications, Tribology in Chemical-Mechanical Planarization provides scientists and engineers with clear foresight to the future of this technology.

Chemical-mechanical planarization (CMP) has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding. New slurries and consumables are under development. New applications to novel devices continue to appear. This book, the most recent in a successful series on CMP, offers a review of the advances to date and provides a comprehensive discussion of the future challenges that must be overcome. Presentations from academia, government labs and industry are featured. Topics include; CMP modeling; CMP science; CMP slurries and particles for planarization of copper, oxide, and other materials; planarization applications including shallow trench isolation (STI), copper damascene, and novel devices and CMP integration.

Tribocorrosion causes the degradation or alteration of materials through the combined action of corrosion and wear. It limits the performance and life-time of installations, machines and devices with moving parts, and controls certain manufacturing processes such as chemical–mechanical polishing. The effects of tribocorrosion are most pronounced on passive metals which owe their corrosion resistance to a thin protecting oxide film. Most corrosion-resistant engineering alloys belong to this category. This book provides an introduction to the developing field of tribocorrosion and an overview of the latest research. Part one reviews basic notions of corrosion and tribology, before presenting the most recent results on the growth and structure of passive oxide films. Tribocorrosion mechanisms under fretting, sliding and erosion conditions, respectively, are then discussed. Part two focuses on methods for measuring and preventing tribocorrosion. It includes chapters on electrochemical techniques, the design of tribocorrosion test equipment, data evaluation and the optimisation of materials’ properties for tribocorrosion systems. Part three presents a selection of tribocorrosion problems in engineering and medicine. Three chapters address the tribocorrosion of medical implants including test methods and clinical implications. Other chapters examine tribocorrosion issues in nuclear power plants, marine environments, automotive cooling circuits, elevated-temperature metal working and chemical–mechanical polishing. With its distinguished editors and international team of expert contributors Tribocorrosion of passive metals and coatings is an invaluable reference tool for engineers and researchers in industry and academia confronted with tribocorrosion problems. Comprehensively reviews current research on the tribocorrosion of passive metals and coatings, with particular reference to the design of tribocorrosion test equipment, data evaluation and the optimisation of materials’ properties for tribocorrosion systems Chapters discuss tribocorrosion mechanisms under fretting, sliding and erosion conditions before focussing on methods for measuring and preventing tribocorrosion Includes a comprehensive selection of tribocorrosion problems in engineering and medicine, such as the tribocorrosion of medical implants, and tribocorrosion issues in nuclear power plants, marine environments, automotive cooling circuits and elevated-temperature metal working

This book draws upon the science of tribology to understand, predict and improve abrasive machining processes. Pulling together information on how abrasives work, the authors, who are renowned experts in abrasive technology, demonstrate how tribology can be applied as a tool to improve abrasive machining processes. Each of the main elements of the abrasive machining system are looked at, and the tribological factors that control the efficiency and quality of the processes are described. Since grinding is by far the most commonly employed abrasive machining process, it is dealt with in particular detail. Solutions are posed to many of the most commonly experienced industrial problems, such as poor accuracy, poor surface quality, rapid wheel wear, vibrations, work-piece burn and high process costs. This practical approach makes this book an essential tool for practicing engineers. Uses the science of tribology to improve understanding and of abrasive machining processes in order to increase performance, productivity and surface quality of final products A comprehensive reference on how abrasives work, covering kinematics, heat transfer, thermal stresses, molecular dynamics, fluids and the tribology of lubricants Authoritative and ground-breaking in its first edition, the 2nd edition includes 30% new and updated material, including new topics such as CMP (Chemical Mechanical Polishing) and precision machining for micro-and nano-scale applications