Ulsi Semiconductor Technology Atlas

More than 1,100 TEM images illustrate the science of ULSI The natural outgrowth of VLSI (Very Large Scale Integration), Ultra Large Scale Integration (ULSI) refers to semiconductor chips with more than 10 million devices per chip. Written by three renowned pioneers in their field, ULSI Semiconductor Technology Atlas uses examples and TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies and their associated problems. The first book available on the subject to be illustrated using TEM images, ULSI Semiconductor Technology Atlas is logically divided into four parts: * Part I includes basic introductions to the ULSI process, device construction analysis, and TEM sample preparation * Part II focuses on key ULSI modules--ion implantation and defects, dielectrics and isolation structures, silicides/salicides, and metallization * Part III examines integrated devices, including complete planar DRAM, stacked cell DRAM, and trench cell DRAM, as well as SRAM as examples for process integration and development * Part IV emphasizes special applications, including TEM in advanced failure analysis, TEM in advanced packaging development and UBM (Under Bump Metallization) studies, and high-resolution TEM in microelectronics This innovative guide also provides engineers and managers in the microelectronics industry, as well as graduate students, with: * More than 1,100 TEM images to illustrate the science of ULSI * A historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issues * Discussion of TEM in other advanced microelectronics devices and materials, such as flash memories, SOI, SiGe devices, MEMS, and CD-ROMs

Semiconductorelectronicsiscommonplaceineveryhousehold.Semiconductor deviceshavealsoenabledeconomicallyreasonable?ber-basedopticalcom- nication, optical storage and high-frequency ampli?cation and have recently revolutionizedphotography,displaytechnologyandlighting.Alongwiththese tremendous technological developments, semiconductors have changed the way we work, communicate, entertain and think. The technological progress of semiconductor materials and devices is evolving continuously with a large worldwide e?ort in human and monetary capital. For students, semicond- tors o?er a rich, diverse and exciting ?eld with a great tradition and a bright future. This book introduces students to semiconductor physics and semicond- tor devices. It brings them to the point where they can specialize and enter supervisedlaboratoryresearch.Itisbasedonthetwosemestersemiconductor physics course taught at Universit ̈ at Leipzig in its Master of Science physics curriculum. Since the book can be followed with little or no pre-existing knowledge in solid-state physics and quantum mechanics, it is also suitable for undergraduate students. For the interested reader some additional topics are included in the book that can be covered in subsequent, more speci- ized courses. The material is selected to provide a balance between aspects of solid-state and semiconductor physics, the concepts of various semiconductor devices and modern applications in electronics and photonics.

Microdisplays are tiny, high-resolution electronic displays, designed for use in magnifying optical systems such as HDTV projectors and near-eye personal viewers. As a result of research and development into this field, Microdisplays are incorporated in a variety of visual electronics, notably new 3G portable communications devices, digital camera technologies, wireless internet applications, portable DVD viewers and wearable PCs. Introduction to Microdisplays encapsulates this market through describing in detail the theory, structure, fabrication and applications of Microdisplays. In particular this book: Provides excellent reference material for the Microdisplay industry through including an overview of current applications alongside a guide to future developments in the field Covers all current technologies and devices such as Silicon Wafer Backplane Technology, Liquid Crystal Devices, Micromechanical Devices, and the emerging area of Organic Light Emitting Diodes Presents guidance on the design of applications of Microdisplays, including Microdisplays for defence and telecoms, from basic principles through to their performance limitations Introduction to Microdisplays is a thorough and comprehensive reference on this emerging topic. It is essential reading for display technology manufacturers, developers, and system integrators, as well as practising electrical engineers, physicists, chemists and specialists in the display field. Graduate students, researchers, and developers working in optics, material science, and telecommunications will also find this a valuable resource. The Society for Information Display (SID) is an international society, which has the aim of encouraging the development of all aspects of the field of information display. Complementary to the aims of the society, the Wiley-SID series is intended to explain the latest developments in information display technology at a professional level. The broad scope of the series addresses all facets of information displays from technical aspects through systems and prototypes to standards and ergonomics

An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.

The main focus of this book is ULSI front-end technology. It covers from the early history of semiconductor science & technology from 1874 to state-of-the-art FINFET technology in 2016. Some ULSI back-end technology is also covered, for example, the science and technology of MIM capacitors for analog CMOS has been included in this book. Contents: PrefaceAuthor BiographyIntroduction to the History of SemiconductorsHistory of MOS TechnologyCMOS Switching Speed Characterization and An Overview Regarding How to Speed Up CMOSLow Power CMOS EngineeringAnalog CMOS TechnologyIndex Readership: The book is useful for researchers in semiconductor technology especially practicing engineers. Keywords: Semiconductor;Integrated Circuits;CMOS;High Speed;Low Power;Digital;Analog;Mixed-Signal;Planar Technology;FINFET;MIM CapacitorReview: Key Features: The book is readable for beginnersThe book is useful for semiconductor technology historiansThe book is useful for practicing engineers

"This text follows the tradition of Sze's highly successful pioneering text on VLSI technology and is updated with the latest advances in the field of microelectronic chip fabrication. Since computer chips are foundations of modern electronics, these topics are essential for the next generation of USLI technologies, allowing more transistors to be packaged on a single chip. Contributing to each chapter are industry experts, specializing in topics such as epitaxy with low temperature process, rapid thermal processes, low damage plasma reactive ion etching, fine line litography, cleaning technology, clean room technology, packing and reliability."--

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