VLSI Design

VLSI Design
Author: K. Lal Kishore,V. S. V. Prabhakar
Publsiher: I. K. International Pvt Ltd
Total Pages: 415
Release: 2013-12-30
Genre: Technology & Engineering
ISBN: 9789380026671

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Aimed primarily for undergraduate students pursuing courses in VLSI design, the book emphasizes the physical understanding of underlying principles of the subject. It not only focuses on circuit design process obeying VLSI rules but also on technological aspects of Fabrication. VHDL modeling is discussed as the design engineer is expected to have good knowledge of it. Various Modeling issues of VLSI devices are focused which includes necessary device physics to the required level. With such an in-depth coverage and practical approach practising engineers can also use this as ready reference. Key features: Numerous practical examples. Questions with solutions that reflect the common doubts a beginner encounters. Device Fabrication Technology. Testing of CMOS device BiCMOS Technological issues. Industry trends. Emphasis on VHDL.

The VLSI Handbook

The VLSI Handbook
Author: Wai-Kai Chen
Publsiher: CRC Press
Total Pages: 1788
Release: 2019-07-17
Genre: Technology & Engineering
ISBN: 1420049674

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Over the years, the fundamentals of VLSI technology have evolved to include a wide range of topics and a broad range of practices. To encompass such a vast amount of knowledge, The VLSI Handbook focuses on the key concepts, models, and equations that enable the electrical engineer to analyze, design, and predict the behavior of very large-scale integrated circuits. It provides the most up-to-date information on IC technology you can find. Using frequent examples, the Handbook stresses the fundamental theory behind professional applications. Focusing not only on the traditional design methods, it contains all relevant sources of information and tools to assist you in performing your job. This includes software, databases, standards, seminars, conferences and more. The VLSI Handbook answers all your needs in one comprehensive volume at a level that will enlighten and refresh the knowledge of experienced engineers and educate the novice. This one-source reference keeps you current on new techniques and procedures and serves as a review for standard practice. It will be your first choice when looking for a solution.

On Optimal Interconnections for VLSI

On Optimal Interconnections for VLSI
Author: Andrew B. Kahng,Gabriel Robins
Publsiher: Springer Science & Business Media
Total Pages: 312
Release: 1994-12-31
Genre: Technology & Engineering
ISBN: 0792394836

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On Optimal Interconnections for VLSI describes, from a geometric perspective, algorithms for high-performance, high-density interconnections during the global and detailed routing phases of circuit layout. First, the book addresses area minimization, with a focus on near-optimal approximation algorithms for minimum-cost Steiner routing. In addition to practical implementations of recent methods, the implications of recent results on spanning tree degree bounds and the method of Zelikovsky are discussed. Second, the book addresses delay minimization, starting with a discussion of accurate, yet algorithmically tractable, delay models. Recent minimum-delay constructions are highlighted, including provably good cost-radius tradeoffs, critical-sink routing algorithms, Elmore delay-optimal routing, graph Steiner arborescences, non-tree routing, and wiresizing. Third, the book addresses skew minimization for clock routing and prescribed-delay routing formulations. The discussion starts with early matching-based constructions and goes on to treat zero-skew routing with provably minimum wirelength, as well as planar clock routing. Finally, the book concludes with a discussion of multiple (competing) objectives, i.e., how to optimize area, delay, skew, and other objectives simultaneously. These techniques are useful when the routing instance has heterogeneous resources or is highly congested, as in FPGA routing, multi-chip packaging, and very dense layouts. Throughout the book, the emphasis is on practical algorithms and a complete self-contained development. On Optimal Interconnections for VLSI will be of use to both circuit designers (CAD tool users) as well as researchers and developers in the area of performance-driven physical design.

Algorithmic and Knowledge Based CAD for VLSI

Algorithmic and Knowledge Based CAD for VLSI
Author: Gaynor E. Taylor,Gordon Russell
Publsiher: IET
Total Pages: 298
Release: 1992
Genre: Computers
ISBN: 086341267X

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Samples the present state-of-the-art in CAD for VLSI, covering both newly developed algorithms and applications of techniques from the artificial intelligence community. The material is based on a tutorial course run in conjunction with the 1991 European Conference on Circuit Theory and Design, and should interest engineers involved in the design and testing of integrated circuits and systems. Annotation copyrighted by Book News, Inc., Portland, OR

VLSI

VLSI
Author: Tomasz Wojcicki
Publsiher: CRC Press
Total Pages: 490
Release: 2014-10-24
Genre: Technology & Engineering
ISBN: 9781466599093

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Recently the world celebrated the 60th anniversary of the invention of the first transistor. The first integrated circuit (IC) was built a decade later, with the first microprocessor designed in the early 1970s. Today, ICs are a part of nearly every aspect of our daily lives. They help us live longer and more comfortably, and do more, faster. All this is possible because of the relentless search for new materials, circuit designs, and ideas happening on a daily basis at industrial and academic institutions around the globe. Showcasing the latest advances in very-large-scale integrated (VLSI) circuits, VLSI: Circuits for Emerging Applications provides a balanced view of industrial and academic developments beyond silicon and complementary metal–oxide–semiconductor (CMOS) technology. From quantum-dot cellular automata (QCA) to chips for cochlear implants, this must-have resource: Investigates the trend of combining multiple cores in a single chip to boost performance of the overall system Describes a novel approach to enable physically unclonable functions (PUFs) using intrinsic features of a VLSI chip Examines the VLSI implementations of major symmetric and asymmetric key cryptographic algorithms, hash functions, and digital signatures Discusses nonvolatile memories such as resistive random-access memory (Re-RAM), magneto-resistive RAM (MRAM), and floating-body RAM (FB-RAM) Explores organic transistors, soft errors, photonics, nanoelectromechanical (NEM) relays, reversible computation, bioinformatics, asynchronous logic, and more VLSI: Circuits for Emerging Applications presents cutting-edge research, design architectures, materials, and uses for VLSI circuits, offering valuable insight into the current state of the art of micro- and nanoelectronics.

VLSI Technology

VLSI Technology
Author: Wai-Kai Chen
Publsiher: CRC Press
Total Pages: 400
Release: 2003-03-19
Genre: Technology & Engineering
ISBN: 9780203011508

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As their name implies, VLSI systems involve the integration of various component systems. While all of these components systems are rooted in semiconductor manufacturing, they involve a broad range of technologies. This volume of the Principles and Applications of Engineering series examines the technologies associated with VLSI systems, including

VLSI Metallization

VLSI Metallization
Author: Norman G. Einspruch,Simon S. Cohen,Gennady Sh. Gildenblat
Publsiher: Academic Press
Total Pages: 491
Release: 2014-12-01
Genre: Technology & Engineering
ISBN: 9781483217819

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VLSI Electronics Microstructure Science, Volume 15: VLSI Metallization discusses the various issues and problems related to VLSI metallization. It details the available solutions and presents emerging trends. This volume is comprised of 10 chapters. The two introductory chapters, Chapter 1 and 2 serve as general references for the electrical and metallurgical properties of thin conducting films. Subsequent chapters review the various aspects of VLSI metallization. The order of presentation has been chosen to follow the common processing sequence. In Chapter 3, some relevant metal deposition techniques are discussed. Chapter 4 presents the methods of VLSI lithography and etching. Conducting films are first deposited at the gate definition step; therefore, the issues related to gate metallization are discussed next in Chapter 5.In Chapter 6, contact metallization is elaborated, and Chapter 7 is devoted to multilevel metallization schemes. Long-time reliability is the subject of Chapter 8, which discusses the issues of contact and interconnect electromigration. GaAs metallization is tackled in Chapter 9. The volume concludes with a general discussion of the functions of interconnect systems in VLSI. Materials scientists, processing and design engineers, and device physicists will find the book very useful.

Very Large Scale Integration VLSI

Very Large Scale Integration  VLSI
Author: D.F. Barbe
Publsiher: Springer Science & Business Media
Total Pages: 312
Release: 2013-03-08
Genre: Technology & Engineering
ISBN: 9783642886409

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Even elementary school students of today know that electronics can do fan tastic things. Electronic calculators make arithmetic easy. An electronic box connected to your TV set provides a wonderful array of games. Electronic boxes can translate languages! Electronics has even changed watches from a pair of hands to a set of digits. Integrated circuit (IC) chips, which use transistors to store information in binary form and perform binary arithmetic, make all of this possible. In just a short twenty years, the field of inte grated circuits has progressed from chips containing several transistors performing simple functions such as OR and AND functions to chips presently available which contain thousands of transistors performing a wide range of memory, control and arithmetic functions. In the late 1970's Very Large Scale Integration (VLSI) caught the imagin ation of the industrialized world. The United States, Japan and other coun tries now have substantial efforts to push the frontier of microelectronics across the one-micrometer barrier and into sub-micrometer features. The achievement of this goal will have tremendous impl ications, both technolo gical and economic for the countries involved.