2022 Ieee International Conference On Wireless For Space And Extreme Environments Wisee

Spaceflight involves critical sensing and communication in extreme environments such as planetary surfaces, space vehicles, and space habitats The many challenges faced in space sensing and communication are extremely diverse and overlap significantly with those found in many terrestrial examples of extreme environments such as extreme hot or cold locations, extreme high or low pressure environments, critical control loops in aircraft and nuclear power plants, high speed rotating equipment, oil gas pipelines and platforms, etc All of these environments pose significant challenges for radio frequency or optical wireless sensing and communication and will require the application of a broad range of state of the art technologies in order to generate reliable and cost effective solutions Although the specific challenges vary significantly from the environment to environment, many of the solutions are discussed in this conference

This IEEE conference will bring together investigators from the National Aeronautics and Space Administration (NASA), the Canadian Space Agency (CSA), the European Space Agency (ESA), and other space agencies, along with industry and academic researchers, in an effort to understand and solve the emerging problems facing wireless sensing and communication in space and related extreme environments

This IEEE conference will bring together investigators from the National Aeronautics and Space Administration (NASA), the Canadian Space Agency (CSA), the European Space Agency (ESA), and other space agencies, along with aerospace and space defense industries and academic researchers, in an effort to understand and solve emerging problems facing wireless sensing and communication in space and related extreme environments

This IEEE conference will bring together investigators from the National Aeronautics and Space Administration (NASA), the Canadian Space Agency (CSA), the European Space Agency (ESA), and other space agencies, along with aerospace and space defense industries and academic researchers, in an effort to understand and solve the emerging problems facing wireless sensing and communication in space and related extreme environments

Spaceflight involves critical sensing and communication in extreme environments such as planetary surfaces, space vehicles, and space habitats The many challenges faced in space sensing and communication are extremely diverse and overlap significantly with those found in many terrestrial examples of extreme environments such as extreme hot or cold locations, extreme high or low pressure environments, critical control loops in aircraft and nuclear power plants, high speed rotating equipment, oil gas pipelines and platforms, etc All of these environments pose significant challenges for radio frequency or optical wireless sensing and communication and will require the application of a broad range of state of the art technologies in order to generate reliable and cost effective solutions Although the specific challenges vary significantly from the environment to environment, many of the solutions are discussed in this conference

This IEEE conference will bring together investigators from the National Aeronautics and Space Administration (NASA), the Canadian Space Agency (CSA), the European Space Agency (ESA), and other space agencies, along with aerospace and space defense industries and academic researchers, in an effort to understand and solve the emerging problems facing wireless sensing and communication in space and related extreme environments

Spaceflight involves critical sensing and communication in extreme environments such as planetary surfaces, space vehicles, and space habitats The many challenges faced in space sensing and communication are extremely diverse and overlap significantly with those found in many terrestrial examples of extreme environments such as extreme hot or cold locations, extreme high or low pressure environments, critical control loops in aircraft and nuclear power plants, high speed rotating equipment, oil gas pipelines and platforms, etc This IEEE conference will bring together investigators from the National Aeronautics and Space Administration (NASA), the Canadian Space Agency (CSA), the European Space Agency (ESA), and other space agencies, along with aerospace and space defense industries and academic researchers, in an effort to understand and solve the emerging problems facing wireless sensing and communication in space and related extreme environments

The success of future innovative technology relies upon a community with a shared vision. Here, we present an overview of the latest technological progress in the field of printed electronics for use in harsh or extreme environments. Each chapter unlocksscientific and engineering discoveries that will undoubtedly lead to progression from proof of concept to device creation. The main topics covered in this book include some of the most promising materials, methods, and the ability to integrate printed materials with commercial components to provide the basis for the next generation of electronics that are dubbed “survivable” in environments with high g‐orces, corrosion, vibration, and large temperature fluctuations. A wide variety of materials are discussed that contribute to robust hybrid electronics, including printable conductive composite inks, ceramics and ceramic matrix composites, polymer‐erived ceramics, thin metal films, elastomers, solders and epoxies, to name a few. Collectively, these materials and associated components are used to construct conductive traces, interconnects, antennas, pressure sensors, temperature sensors, power inducting devices, strain sensors and gauges, soft actuators, supercapacitors, piezo ionic elements, resistors, waveguides, filters, electrodes, batteries, various detectors, monitoring devices, transducers, and RF systems and graded dielectric, or graded index (GRIN) structures. New designs that incorporate the electronics as embedded materials into channels, slots and other methods to protect the electronics from the extreme elements of the operational environment are also envisioned to increase their survivability while remaining cognizant of the required frequency of replacement, reapplication and integration of power sources. Lastly, the ability of printer manufacturers, software providers and users to work together to build multi‐axis, multi‐material and commercial‐off‐the‐shelf (COTS) integration into user‐friendly systems will be a great advancement for the field of printed electronics. Therefore, the blueprint for manufacturing resilient hybrid electronics consists of novel designs that exploit the benefits of advances in additive manufacturing that are then efficiently paired with commercially available components to produce devices that exceed known constraints. As a primary example, metals can be deposited onto polymers in a variety of ways, including aerosol jetting, microdispensing, electroplating, sintering, vacuum deposition, supersonic beam cluster deposition, and plasma‐based techniques, to name a few. Taking these scientific discoveries and creatively combining them into robotic, multi‐material factories of the future could be one shared aim of the printed electronics community toward survivable device creation.