Adhesives Sealants And Coatings For The Electronics Industry

The second edition of this industrial guide contains descriptions of some 2,500 adhesive, sealants, and coatings, based on information provided by manufacturers and distributors of these products. The volume is divided into 11 sections based on end use: adhesives--general; adhesives--cyanocrylate; adhesives--epoxy; caulks and sealants; coatings; conductive compounds; encapsulating, potting, casting, impregnating compounds; films and tapes; insulating products; silicones; and miscellaneous. Each product lists, as available, company name and product category; tradename and product number; and product description/specification. Typical end uses may also be included. Includes a list of suppliers' addresses. Annotation copyrighted by Book News, Inc., Portland, OR

New technologies constantly generate new demands for exotic materials to be used in severe environments. The rapid developments of aerospace industries during the last two decades have required new materials to survive extreme high and low temperatures and various radiations. The exploration of new energy sources, e.g., solar and geothermal, has led us to develop new solar collectors and geothermal devices. Even the search for new oils has demanded that we study the corrosive environment of oil fields. In the telecommunication industries, optical fibers have been adopted broadly to replace metallic conductors. However, none of the optical fibers can survive abrasion or corrosion without the application of a coating material. For microelectronics, protection in terms of coatings and encapsulants is deemed necessary to prevent corrosion. One of the major causes of corrosion has been shown to be water which appears to be abundant in our earthly environments. Water can attack the bulk adhesive (or sealant), the interface, or the adherend. Water can also cause delamination of coating film, and it is definitely the major ingredient in causing cathodic or anodic corrosion. Thus, water becomes the major obstacle in solving durability problems of various materials in harsh environments.

Approx.512 pages Approx.512 pages

The second edition of this popular industrial guide describes over 2,800 currently available epoxy resins, curing agents, compounds, and modifiers, based on information supplied by 71 manufacturers or distributors of these products. Epoxy resins have experienced tremendous growth since their introduction in the 1950s. Future growth will be in new markets in the specialty performance areas and high-technology applications. Each raw material or product is described, as available, with typical assay or checkpoint figures and a brief summary of important features or applications. Additional sections useful to the reader are the Suppliers' Addresses and a Trade Name Index.

Handbook of Adhesives and Sealants is the most comprehensive Adhesives and Sealants Handbook ever published, with the cooperation of around 35 authors from all over the world – each one a specialist in their field. It will include 80 chapters dealing with general information, theory of bonding and sealing, design of bonding parts, technical characteristics, chemistry, types of adhesives, application, equipment, controls, standards etc. Industrial applications such as automotive, aeronautics, building and civil engineering, electronics, packaging, wood, furniture, metals, plastics and composites, textiles, footwear etc. Over 1,000 real-life examples illustrate the do's and don'ts of using adhesives Every scientific and technical issue concerning every chemical type in every industry Designed to help solve problems quickly, the content is structured to allow readers to navigate this comprehensive resource in 4 different ways

This unique report covers both technical and market information on adhesives and sealants in one volume. It provides an excellent analysis of the state-of-the-art in the adhesives and sealants industry. The report covers global market data and focuses on Western Europe and North America, with additional information about the emerging markets in the Far East and Latin America.

This first book in the Materials and Processes for Electronics Applications series answers questions vital to the successful design and manufacturing of electronic components, modules, and systems such as: - How can one protect electronic assemblies from prolonged high humidity, high temperatures, salt spray or other terrestrial and space environments? - What coating types can be used to protect microelectronics in military, space, automotive, or medical environments? - How can the chemistry of polymers be correlated to desirable physical and electrical properties? - How can a design engineer avoid subsequent potential failures due to corrosion, metal migration, electrical degradation, outgassing? - What are the best processes that manufacturing can use to mask, clean, prepare the surface, dispense the coating, and cure the coating? - What quality assurance and in-process tests can be used to assure reliability? - What government or industry specifications are available? - How can organic coatings be selected to meet OSHA, EPA, and other regulations? Besides a discussion of the traditional roles of coatings for moisture and environmental protection of printed circuit assemblies, this book covers dielectric coatings that provide electrical functions such as the low-dielectric-constant dielectrics used to fabricate multilayer interconnect substrates and high-frequency, high-speed circuits. Materials engineers and chemists will benefit greatly from a chapter on the chemistry and properties of the main types of polymer coatings including: Epoxies, Polyimides, Silicones, Polyurethanes, Parylene, Benzocyclobenzene and many others. For manufacturing personnel, there is an entire chapter of over a dozen processes for masking, cleaning, and surface preparation and a comprehensive review of over 20 processes for the application and curing of coatings including recent extrusion, meniscus, and curtain coating methods used in processing large panels. The pros and cons of each method are given to aid the engineer in selecting the optimum method for his/her application. As a bonus, from his own experience, the author discusses some caveats that will help reduce costs and avoid failures. Finally, the author discusses regulations of OSHA, EPA, and other government agencies which have resulted in formulation changes to meet VOC and toxicity requirements. Tables of numerous military, commercial, industry, and NASA specifications are given to help the engineer select the proper callout.