Composite Materials For Electronic Functions

Composite materials are traditionally designed for the mechanical properties, due to their structural applications. However, composite materials are increasingly used in non-structural applications, such as electronic packaging and thermal management. Moreover, structural composite materials that are multifunctional are increasingly needed, due to the demand of smart structures and the importance of weight saving. As a consequence, structural materials that can provide electronic functions are needed. Thus, electronic functions are desirable for both non-structural and structural composite materials.

Composite Materials is a modern reference book, tutorial in style, covering functions of composites relating to applications in electronic packaging, thermal management, smart structures and other timely technologies rarely covered in existing books on composites. It also treats materials with polymer, metal, cement, carbon and ceramics matrices, contrasting with others that emphasise polymer-matrix composites. This functional approach will be useful to both practitioners and students. A good selection of example problems, solutions and figures, together with a new and vibrant approach, provides a valuable reference source for all engineers working with composite materials.

Composite materials are traditionally designed for the mechanical properties, due to their structural applications. However, composite materials are increasingly used in non-structural applications, such as electronic packaging and thermal management. Moreover, structual composite materials that are multifunctional are increasingly needed, due to the demand of smart structures and the importance of weight saving. As a consequence, structural materials that can provide electronic functions are needed. Thus, electronic functions are desirable for boht non-structural and structural composite materials.

This 2005 book describes the processing, simulation and applications of electronic composites.

This new volume focuses on different aspects of composite systems that are associated with research and development, helping to bridge the gap between classical analysis and modern real-life applications. The chapters look at the experimental and theoretical aspects of composite materials, regarding preparation, processing, design, properties, and practical implications. It also presents recent advancements, research, and development prospects of advanced composite materials that provide new solutions for advanced technologies.

Composites are the fastest growing class of structural material. Consequently, electronic properties are often difficult to find. This report was prepared in order to present a compilation of reliable data on the electronic and electrical properties of composites. Composites provide an opportunity to tailor the properties to the application; a factor that allows designers an unlimited variety of new materials for new uses. It is this feature that has contributed to the rapid growth of composites. The electrical properties of a composite can be of vital importance in the use or application of the material in a system. The designer therefore, must be able to obtain the necessary electrical or electronic property data to guide him in the materials selection. It is the purpose of this report to assist the designer and engineer in fulfilling that requirement. Properties This report provides a compilation of the most commonly required electronic properties data of structural composites. Thermal properties often influence electrical design; consequently several of these properties are included. The specific properties tabulated are: Arc Resistance Thermal Conductivity Arc Tracking Resistance Linear Thermal Expansion Dielectric Constant Coefficient Dissipation Factor Electrical (Volume) Resistivity Electrical (Volume) Conductivity Other electrical and thermal properties are compiled as the data was made available.

The recent rapid progress in wireless telecommunication, including the Internet of Things, 5th generation wireless systems, satellite broadcasting, and intelligent transport systems has increased the need for low-loss dielectric materials and modern fabrication techniques. These materials have excellent electrical, dielectric, and thermal properties and have enormous potential, especially in wireless communication, flexible electronics, and printed electronics. Microwave Materials and Applications discusses the methods commonly employed for measuring microwave dielectric properties, the various attempts reported to solve problems of materials chemistry and crystal structure, doping, substitution, and composite formation, highlighting the processing techniques, morphology influences, and applications of microwave materials whilst summarizing many of the recent technical research accomplishments in the area of microwave dielectrics and applications Chapters examine: Oxide ceramics for dielectric resonators and substrates HTCC, LTCC and ULTCC tapes for substrates Polymer ceramic composites for printed circuit boards Elastomer-ceramic composites for flexible electronics Dielectric inks EMI shielding materials Microwave ferrites A comprehensive Appendix presents the fundamental properties for more than 4000 low-loss dielectric ceramics, their composition, crystal structure, and their microwave dielectric properties. Microwave Materials and Applications presents a comprehensive view of all aspects of microwave materials and applications, making it useful for scientists, industrialists, engineers, and students working on current and emerging applications of wireless communications and consumer electronics.